Inventor

JAO HUI MEI

TW3 patents

⚠️ This page may combine multiple inventors who share the name “JAO HUI MEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH TUNG-TI

2 patents

US8748885B2Jun 10, 2014

Soft material wafer bonding and method of bonding

YEH TUNG-TI2 citations55

US8592297B2Nov 26, 2013

Wafer and method of processing wafer

YEH TUNG-TI0 citations44

TAIWAN SEMICONDUCTOR MFG

1 patent

US9368387B2Jun 14, 2016

Method of forming shallow trench isolation structure

TAIWAN SEMICONDUCTOR MFG0 citations33