Inventor
TSENG CHIEN-FU
TW22 patents
⚠️ This page may combine multiple inventors who share the name “TSENG CHIEN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TSENG CHIEN-FU
6 patentsUS8429501B2Apr 23, 2013
Memory storage device, memory controller thereof, and method thereof for generating log likelihood ratio
TSENG CHIEN-FU22 citations91
US8510637B2Aug 13, 2013
Data reading method, memory storage apparatus and memory controller thereof
TSENG CHIEN-FU18 citations83
US8289771B2Oct 16, 2012
Data reading method and control circuit and memory controller using the same
TSENG CHIEN-FU10 citations83
US8832526B2Sep 9, 2014
Data reading method, memory controller, and memory storage device
TSENG CHIEN-FU2 citations61
US8276033B2Sep 25, 2012
Data writing method for a flash memory, and flash memory controller and flash memory storage apparatus using the same
TSENG CHIEN-FU2 citations60
US8154974B2Apr 10, 2012
Holographic data storing method and storing device
TSENG CHIEN-FU0 citations50
PHISON ELECTRONICS CORP
5 patentsUS8386860B2Feb 26, 2013
Methods of calculating compensation voltage and adjusting threshold voltage and memory apparatus and controller
PHISON ELECTRONICS CORP25 citations92
US9543983B2Jan 10, 2017
Decoding method, memory storage device and memory control circuit unit
PHISON ELECTRONICS CORP4 citations72
US9342404B2May 17, 2016
Decoding method, memory storage device, and memory controlling circuit unit
PHISON ELECTRONICS CORP5 citations72
US10193569B2Jan 29, 2019
Decoding method, memory storage device and memory control circuit unit
PHISON ELECTRONICS CORP3 citations66
US9362951B2Jun 7, 2016
Decoding method, decoding circuit, memory storage device and controlling circuit unit
PHISON ELECTRONICS CORP0 citations41
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS11756870B2Sep 12, 2023
Stacked via structure disposed on a conductive pillar of a semiconductor die
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12191239B2Jan 7, 2025
Stacked via structure disposed on a conductive pillar of a semiconductor die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10049898B2Aug 14, 2018
Semiconductor device packages, packaging methods, and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9558966B2Jan 31, 2017
Semiconductor device packages, packaging methods, and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
IND TECH RES INST
3 patentsUS7724636B2May 25, 2010
Asymmetry compensator for partial response maximum likelihood (PRML) decoder
IND TECH RES INST9 citations83
US7944795B2May 17, 2011
Holographic recording medium and encoding/decoding method thereof
IND TECH RES INST0 citations51
US7957045B2Jun 7, 2011
Hologram media reading apparatus
IND TECH RES INST0 citations40