P

Inventor

CHEN ZHIJUN

CN110 patents
⚠️ This page may combine multiple inventors who share the name “CHEN ZHIJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

31 patents
US9991134B2Jun 5, 2018

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC100 citations99
US9837284B2Dec 5, 2017

Oxide etch selectivity enhancement

APPLIED MATERIALS INC112 citations99
US9704723B2Jul 11, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC125 citations99
US9613822B2Apr 4, 2017

Oxide etch selectivity enhancement

APPLIED MATERIALS INC128 citations99
US9478432B2Oct 25, 2016

Silicon oxide selective removal

APPLIED MATERIALS INC129 citations99
US9449850B2Sep 20, 2016

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC135 citations99
US9449845B2Sep 20, 2016

Selective titanium nitride etching

APPLIED MATERIALS INC138 citations99
US9437451B2Sep 6, 2016

Radical-component oxide etch

APPLIED MATERIALS INC134 citations99
US9355863B2May 31, 2016

Non-local plasma oxide etch

APPLIED MATERIALS INC130 citations99
US9349605B1May 24, 2016

Oxide etch selectivity systems and methods

APPLIED MATERIALS INC156 citations99
US9209012B2Dec 8, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC173 citations99
US9184055B2Nov 10, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC220 citations99
US9111877B2Aug 18, 2015

Non-local plasma oxide etch

APPLIED MATERIALS INC182 citations99
US9093371B2Jul 28, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC187 citations99
US9023734B2May 5, 2015

Radical-component oxide etch

APPLIED MATERIALS INC182 citations99
US8956980B1Feb 17, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC226 citations99
US8921234B2Dec 30, 2014

Selective titanium nitride etching

APPLIED MATERIALS INC187 citations99
US10062579B2Aug 28, 2018

Selective SiN lateral recess

APPLIED MATERIALS INC95 citations98
US9768034B1Sep 19, 2017

Removal methods for high aspect ratio structures

APPLIED MATERIALS INC118 citations98
US9406523B2Aug 2, 2016

Highly selective doped oxide removal method

APPLIED MATERIALS INC135 citations98
US9390937B2Jul 12, 2016

Silicon-carbon-nitride selective etch

APPLIED MATERIALS INC132 citations98
US9202708B1Dec 1, 2015

Doped silicon oxide etch

APPLIED MATERIALS INC110 citations98
US10319603B2Jun 11, 2019

Selective SiN lateral recess

APPLIED MATERIALS INC12 citations84
US10468267B2Nov 5, 2019

Water-free etching methods

APPLIED MATERIALS INC2 citations73
US10424463B2Sep 24, 2019

Oxide etch selectivity systems and methods

APPLIED MATERIALS INC1 citations73
US10424464B2Sep 24, 2019

Oxide etch selectivity systems and methods

APPLIED MATERIALS INC2 citations73
US10204795B2Feb 12, 2019

Flow distribution plate for surface fluorine reduction

APPLIED MATERIALS INC2 citations73
US10128086B1Nov 13, 2018

Silicon pretreatment for nitride removal

APPLIED MATERIALS INC3 citations73

XIAOMI INC

13 patents

UNIV ZHEJIANG TECHNOLOGY

1 patent

MEI WANGSHENG

1 patent

SHANGHAI BEDSURE TECH CO LTD

1 patent

FREESCALE SEMICONDUCTOR INC

1 patent

HUAWEI DEVICE DONGGUAN CO LTD

1 patent

SUI ZHILING

1 patent

Showing the top 50 of 110 patents by PatentIndex Score.