Inventor

GRUBE GARY W

US750 patents

⚠️ This page may combine multiple inventors who share the name “GRUBE GARY W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUBE GARY W

FORMFACTOR INC

Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods

Method and apparatus for shaping spring elements

Apparatuses and methods for cleaning test probes

Microelectronic spring with additional protruding member

Microelectronic contact structures, and methods of making same

Lithographic contact elements

Resilient contact structures for interconnecting electronic devices

Method of manufacturing a probe card

Method and apparatus for shaping spring elements

Spring interconnect structures

Method and apparatus for burning-in semiconductor devices in wafer form

Probe card assembly

Method of making lithographic contact springs

Sockets for “springed” semiconductor devices

Microelectronic contact structures, and methods of making same

Planarizer for a semiconductor contactor

Methods for making spring interconnect structures

Probe card for probing wafers with raised contact elements

Microelectronic spring contact element and electronic component having a plurality of spring contact elements

Method of making microelectronic contact structures

Lithographic contact elements

Probe card assembly and kit, and methods of using same

Sockets for “springed” semiconductor devices

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Making discrete power connections to a space transformer of a probe card assembly

Wafer-level test and burn-in, and semiconductor process

Sockets for &#34;springed&#34; semiconductor devices

Method of testing semiconductor

Method of temporarily, then permanently, connecting to a semiconductor device

Method of planarizing tips of probe elements of a probe card assembly

Mounting spring elements on semiconductor devices

Method of burning-in semiconductor devices

Method of making contact tip structures

Method of making temporary connections between electronic components

Method of mounting resilient contact structures to semiconductor devices

MOTOROLA INC

Method and apparatus for monitoring environmental conditions in a communication system

Method for providing software to a remote computer

Method for providing communication services based on geographic location

Method for determining geographic relationships between communication units

Determining and displaying available services for a communication unit

Method and apparatus for preventing unauthorized monitoring of wireless data transmissions

Method of configuring a communication unit using a wireless portable configuration device

TESSERA INC

Semiconductor connection components and methods with releasable lead support

Methods of making semiconductor connection components with releasable load support

Semiconductor connection components and methods with releasable lead support

(unassigned)

Method of fabricating an interconnection element

Method and apparatus for providing infrastructure call support

GRUBE GARY W

Migrating encoded data slices from a re-provisioned memory device of a dispersed storage network memory

Sockets for "springed" semiconductor devices