Inventor

FREY JENS

DE30 patents

⚠️ This page may combine multiple inventors who share the name “FREY JENS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREY JENS

BOSCH GMBH ROBERT

Rotation rate sensor

Rotational rate sensor

Sensor unit including a decoupling structure and manufacturing method therefor

Laser reseal including an additional layer and alloy formation

Micromechanical component

Micromechanical component and manufacturing method

Micromechanical component

Micromechanical device and method for manufacturing a micromechanical device

Laser sealing methods for closing ventholes of micromecahnical devices

Micromechanical component and method for producing a micromechanical component

Micromechanical sensor device

Method for manufacturing a micromechanical component

Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

ASIC element, in particular as a component of a vertically integrated hybrid component

Component in the form of a wafer level package and method for manufacturing same

MEMS component having two different internal pressures

Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface

FREY JENS

Sensor module

Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches

Method for manufacturing a hybrid integrated component

CLASSEN JOHANNES

Hybrid integrated component

Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap

Hybrid intergrated component

REINMUTH JOCHEN

Method for manufacturing a component having an electrical through-connection

Method for manufacturing a component having an electrical through-connection

GONSKA JULIAN

Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates

Component having a via and method for manufacturing it

WREDE MARTIN

Micromechanical yaw-rate sensor

WEBER HERIBERT

ASIC element including a via

BRUENDEL MATHIAS

Method for producing a two-chip assembly and corresponding two-chip assembly