P

Inventor

WEBER HERIBERT

DE88 patents
⚠️ This page may combine multiple inventors who share the name “WEBER HERIBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOSCH GMBH ROBERT

31 patents
US7037438B2May 2, 2006

Method for production of a semiconductor component and a semiconductor component produced by said method

BOSCH GMBH ROBERT18 citations93
US6803637B2Oct 12, 2004

Micromechanical component with different doping types so that one type is anodized into porous silicon

BOSCH GMBH ROBERT37 citations93
US6336360B1Jan 8, 2002

Device for measuring the mass of a medium flowing in a line

BOSCH GMBH ROBERT31 citations93
US6240777B1Jun 5, 2001

Sensor having a membrane

BOSCH GMBH ROBERT24 citations92
US7148077B2Dec 12, 2006

Micromechanical structural element having a diaphragm and method for producing such a structural element

BOSCH GMBH ROBERT27 citations91
US7479232B2Jan 20, 2009

Method for producing a semiconductor component and a semiconductor component produced according to the method

BOSCH GMBH ROBERT8 citations84
US7300854B2Nov 27, 2007

Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method

BOSCH GMBH ROBERT14 citations84
US7193290B2Mar 20, 2007

Semiconductor component and a method for producing the same

BOSCH GMBH ROBERT10 citations84
US7160750B2Jan 9, 2007

Method of producing a semiconductor sensor component

BOSCH GMBH ROBERT10 citations84
US7045382B2May 16, 2006

Method for producing micromechanic sensors and sensors produced by said method

BOSCH GMBH ROBERT17 citations84
US6820481B1Nov 23, 2004

Mass flow sensor having an improved membrane stability

BOSCH GMBH ROBERT16 citations84
US6523403B1Feb 25, 2003

Mass flow sensor

BOSCH GMBH ROBERT18 citations83
US7306966B2Dec 11, 2007

Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor

BOSCH GMBH ROBERT6 citations74
US6840111B2Jan 11, 2005

Micromechanical component and pressure sensor having a component of this type

BOSCH GMBH ROBERT10 citations74
US6832523B2Dec 21, 2004

Micromechanical component and manufacturing method

BOSCH GMBH ROBERT10 citations74
US6565765B1May 20, 2003

Method for manufacturing a sensor having a membrane

BOSCH GMBH ROBERT11 citations74
US6365055B1Apr 2, 2002

Process for producing a sensor membrane substrate

BOSCH GMBH ROBERT8 citations74
US9518877B2Dec 13, 2016

Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor device

BOSCH GMBH ROBERT5 citations73
US7833405B2Nov 16, 2010

Micromechanical component and corresponding production method

BOSCH GMBH ROBERT7 citations71
US9567212B2Feb 14, 2017

Micromechanical component

BOSCH GMBH ROBERT2 citations70
US7343806B2Mar 18, 2008

Pressure sensor featuring pressure loading of the fastening element

BOSCH GMBH ROBERT5 citations63
US6303990B1Oct 16, 2001

Conductor path contacting arrangement and method

BOSCH GMBH ROBERT5 citations63
US11976996B2May 7, 2024

Micromechanical component for a capacitive pressure sensor device

BOSCH GMBH ROBERT1 citations62
US11933689B2Mar 19, 2024

MEMS capacitive sensor including improved contact separation

BOSCH GMBH ROBERT1 citations62
US11912563B2Feb 27, 2024

Micromechanical component and method for manufacturing a micromechanical component

BOSCH GMBH ROBERT1 citations62
US11788912B2Oct 17, 2023

Micromechanical pressure sensor device including a diaphragm system and corresponding manufacturing method

BOSCH GMBH ROBERT0 citations62
US7705413B2Apr 27, 2010

Micromechanical component and method for producing a micromechanical component

BOSCH GMBH ROBERT3 citations61
US12570521B2Mar 10, 2026

Micromechanical component for a sensor and/or microphone device

BOSCH GMBH ROBERT0 citations52
US12163851B2Dec 10, 2024

Micromechanical component for a sensor device having a capacitor sealing structure

BOSCH GMBH ROBERT0 citations52
US11407635B2Aug 9, 2022

Bonding pad layer system, gas sensor and method for manufacturing a gas sensor

BOSCH GMBH ROBERT0 citations52
US9365417B2Jun 14, 2016

Method for manufacturing a micromechanical component

BOSCH GMBH ROBERT1 citations52

BUEHLER AG

3 patents

PARAGON AG

2 patents

WEBER HERIBERT

2 patents

TELEFUNKEN MICROELECTRON

1 patent

AHLES MARCUS

1 patent

BENZEL HUBERT

1 patent

SULZER AG

1 patent

PINTER STEFAN

1 patent

REINMUTH JOCHEN

1 patent

FREY JENS

1 patent

SIEMENS AG

1 patent

KNESE KATHRIN

1 patent

PIRK TJALF

1 patent

SCHEUERER ROLAND

1 patent

SCHLOSSER ROMAN

1 patent

Showing the top 50 of 88 patents by PatentIndex Score.