Inventor

TI YANG

CN3 patents

Patents

3 patents

US12590228B2Mar 31, 2026

Curable adhesive composition for die attach

HENKEL AG & CO KGAA0 citations54

US12344739B2Jul 1, 2025

Conductive epoxy resin composition for copper bonding

HENKEL AG & CO KGAA0 citations54

US12051522B2Jul 30, 2024

Silver sintering composition containing copper alloy for metal bonding

HENKEL AG & CO KGAA0 citations53