Inventor

ZHAO JIAWEN

CN2 patents

Patents

2 patents

US12590228B2Mar 31, 2026

Curable adhesive composition for die attach

HENKEL AG & CO KGAA0 citations54

US12344739B2Jul 1, 2025

Conductive epoxy resin composition for copper bonding

HENKEL AG & CO KGAA0 citations54