Inventor
PAN SAMUEL C
TW76 patents
⚠️ This page may combine multiple inventors who share the name “PAN SAMUEL C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
44 patentsUS9978868B2May 22, 2018
Negative capacitance field effect transistor with charged dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD35 citations93
US9490430B1Nov 8, 2016
Field effect transistors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US10269981B2Apr 23, 2019
Multi-channel field effect transistors using 2D-material
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9553199B2Jan 24, 2017
FET device having a vertical channel in a 2D material layer
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations84
US9559168B2Jan 31, 2017
Field effect transistors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US9496259B2Nov 15, 2016
FinFET semiconductor device having fins with stronger structural strength
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10332985B2Jun 25, 2019
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations82
US10832957B2Nov 10, 2020
Method for direct forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10516050B2Dec 24, 2019
Method for forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9934969B2Apr 3, 2018
Charged-particle-beam patterning without resist
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9859115B2Jan 2, 2018
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11502174B2Nov 15, 2022
Method for reducing Schottky barrier height and semiconductor device with reduced Schottky barrier height
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10985019B2Apr 20, 2021
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10797137B2Oct 6, 2020
Method for reducing Schottky barrier height and semiconductor device with reduced Schottky barrier height
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10636652B2Apr 28, 2020
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269564B2Apr 23, 2019
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10461254B2Oct 29, 2019
Methods of graphene growth and related structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9923142B2Mar 20, 2018
Methods of graphene growth and related structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11031510B2Jun 8, 2021
Impact ionization semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations70
US10510903B2Dec 17, 2019
Impact ionization semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US9577078B1Feb 21, 2017
Structure and formation method of semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations70
US9941380B2Apr 10, 2018
Graphene transistor and related methods
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations68
US9412439B1Aug 9, 2016
Hybrid TFET-MOSFET circuit design
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations68
US11817481B2Nov 14, 2023
Method for reducing Schottky barrier height and semiconductor device with reduced Schottky barrier height
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11538938B2Dec 27, 2022
Method for forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11211460B2Dec 28, 2021
2D crystal hetero-structures and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11164972B2Nov 2, 2021
Method for forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10978461B2Apr 13, 2021
Antifuse array and method of forming antifuse using anodic oxidation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10957602B2Mar 23, 2021
Method for direct forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11563009B2Jan 24, 2023
Semiconductor memory device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10957784B2Mar 23, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12308371B2May 20, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11791410B2Oct 17, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11605674B2Mar 14, 2023
Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11063149B2Jul 13, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11024674B2Jun 1, 2021
Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11152473B2Oct 19, 2021
Device with doped phosphorene and method for doping phosphorene
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10879404B2Dec 29, 2020
Multi-channel field effect transistors using 2D-material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10615036B2Apr 7, 2020
Charged-particle-beam patterning without resist
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510611B2Dec 17, 2019
Method for direct forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10504907B2Dec 10, 2019
Antifuse array and method of forming antifuse using anodic oxidation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10347538B2Jul 9, 2019
Method for direct forming stressor, semiconductor device having stressor, and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157737B2Dec 18, 2018
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9953989B2Apr 24, 2018
Antifuse array and method of forming antifuse using anodic oxidation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
MACRONIX INT CO LTD
5 patentsUS6177317B1Jan 23, 2001
Method of making nonvolatile memory devices having reduced resistance diffusion regions
MACRONIX INT CO LTD403 citations98
US6829175B2Dec 7, 2004
Erasing method for non-volatile memory
MACRONIX INT CO LTD47 citations96
US6413818B1Jul 2, 2002
Method for forming a contoured floating gate cell
MACRONIX INT CO LTD36 citations92
US6248631B1Jun 19, 2001
Method for forming a v-shaped floating gate
MACRONIX INT CO LTD26 citations92
US6787056B2Sep 7, 2004
Planarization method using anisotropic wet etching
MACRONIX INT CO LTD2 citations61
PAN SAMUEL C
1 patentShowing the top 50 of 76 patents by PatentIndex Score.