Inventor

HOANG ELIZABETH

US2 patents

Patents

2 patents

US10985108B2Apr 20, 2021

Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof

Henkel IP & Holding GmbH0 citations53

US9230888B2Jan 5, 2016

Wafer back side coating as dicing tape adhesive

Henkel IP & Holding GmbH0 citations39