Inventor

HONG WILLIAM WEILUN

TW29 patents

⚠️ This page may combine multiple inventors who share the name “HONG WILLIAM WEILUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HONG WILLIAM WEILUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Hard mask removal method

Hard mask removal method

Hard mask removal method

Hard mask removal method

CMP system and method of use

Doped poly-silicon for polyCMP planarity improvement

Hard mask removal method

Metal heterojunction structure with capping metal layer

Post-CMP cleaning composition for germanium-containing substrate

Metal heterojunction structure with capping metal layer

CMP slurry and CMP method

Metal heterojunction structure with capping metal layer

CMP system and method of use

CMP system and method of use

Planarization control in semiconductor manufacturing process

Methods for reducing scratch defects in chemical mechanical planarization

Hotspot avoidance method of manufacturing integrated circuits

Hotspot avoidance method of manufacturing integrated circuits

Hotspot avoidance method for manufacturing integrated circuits

Vias with metal caps for underlying conductive lines

CMP slurry and CMP method

Doped poly-silicon for PolyCMP planarity improvement

Method and apparatus for semiconductor planarization

Chemical mechanical planarization using nano-abrasive slurry

Surface treatment in a chemical mechanical process

Asymmetric application of pressure to a wafer during a CMP process

Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process

Composite structure for gate level inter-layer dielectric

TAIWAN SEMICONDUCTOR MFG

CMP slurry particle breakup