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Inventor
KANG TAE-HYEOG
KR
2 patents
Patents
2 patents
US7065869B2
Jun 27, 2006
Method for plating of printed circuit board strip
SAMSUNG ELECTRO MECH
9 citations
69
US7960822B2
Jun 14, 2011
Package on package substrate
SAMSUNG ELECTRO MECH
6 citations
57