Inventor

EYA SEISHI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “EYA SEISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

2 patents

US7168058B2Jan 23, 2007

Printed circuit wiring board designing support device, printed circuit board designing method, and its program

NEC CORP22 citations89

US6774641B2Aug 10, 2004

Printed circuit board design support apparatus, method, and program

NEC CORP10 citations71

NEC INFORMATEC SYSTEMS LTD

1 patent

US7216327B2May 8, 2007

Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method

NEC INFORMATEC SYSTEMS LTD4 citations55