Inventor

LEE IN YOUNG

KR68 patents

⚠️ This page may combine multiple inventors who share the name “LEE IN YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE IN YOUNG

SAMSUNG ELECTRONICS CO LTD

Reinforced solder bump structure and method for forming a reinforced solder bump

Electronic device including multiband antenna

Electronic device including multiband antenna

Interconnection structure of integrated circuit chip

Reinforced solder bump structure and method for forming a reinforced solder bump

Antenna for wearable device

Electronic device including multiband antenna

Electronic device including multi-band antenna

Method of manufacturing semiconductor package

Semiconductor packages having through electrodes and methods for fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device having through vias

Wafer level package having redistribution interconnection layer and method of forming the same

Wafer level chip scale package having a gap and method for manufacturing the same

Electronic device comprising array antenna

Semiconductor packages having through electrodes and methods of fabricating the same

Semiconductor packages having through electrodes and methods of fabricating the same

Semiconductor packages including a heat spreader and methods of forming the same

Antenna device and electronic device including same

Semiconductor package and method of fabricating the same

Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same

Board on chip package and method of manufacturing the same

Antenna for wearable device

Electronic device including multiband antenna

Antenna for wearable device

Electronic device including multiband antenna

Electronic device including multiband antenna

Electronic device including multiband antenna

Wafer level chip scale package having a gap and method for manufacturing the same

Antenna for wearable device

Electronic device including multiband antenna

Apparatus for generating independent coherent beam array using 45-degree mirrors

Apparatus for generating independent coherent beam array

Wafer-level stack package and method of fabricating the same

Wafer level package and method of fabricating the same

Electronic device including multiband antenna

Electronic device comprising antenna

Electronic device comprising antenna

Semiconductor device and method of fabricating the same

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

KOREA HYDRO & NUCLEAR POWER CO

V2O5-based catalyst for removing NOx from flue gas and preparing method therefor

LEE HO-JIN

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

KOREA ELECTRIC POWER CORP

Method of regenerating honeycomb type SCR catalyst by air lift loop reactor

KMW INC

Signal process apparatus for phase-shifting N number of signals inputted thereto

KWAK BYOUNG SOO

Semiconductor device including multiple semiconductor chips

KOREA RES INST OF BIOSCIENCE

Segregation reducing agent consisting of curdlan and alkaline solution and hydraulic composition containing the segregation reducing agent

JO CHA-JEA

Method of manufacturing a chip stack package

LEE CHANG-CHEOL

Semiconductor package including semiconductor chip with through opening

KOREA ELECTRONICS TELECOMM

Switch, negative resistance cell, and differential voltage controlled oscillator using the same