Inventor
CHEN QIANWEN
US43 patents
⚠️ This page may combine multiple inventors who share the name “CHEN QIANWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
42 patentsUS10217637B1Feb 26, 2019
Chip handling and electronic component integration
IBM35 citations98
US10490525B1Nov 26, 2019
High speed handling of ultra-small chips by selective laser bonding and debonding
IBM5 citations84
US9735077B1Aug 15, 2017
Heterogeneous miniaturization platform
IBM5 citations84
US12014816B2Jun 18, 2024
Multi-sensor platform for health monitoring
IBM3 citations73
US10658182B2May 19, 2020
Chip handling and electronic component integration
IBM1 citations73
US10535994B2Jan 14, 2020
Air gap metal tip electrostatic discharge protection
IBM1 citations73
US10530150B2Jan 7, 2020
Air gap metal tip electrostatic discharge protection
IBM2 citations73
US10395929B2Aug 27, 2019
Chip handling and electronic component integration
IBM2 citations73
US10380284B2Aug 13, 2019
Heterogeneous miniaturization platform
IBM2 citations73
US11908723B2Feb 20, 2024
Silicon handler with laser-release layers
IBM0 citations62
US11539080B2Dec 27, 2022
Miniaturized electronics package with patterned thin film solid state battery
IBM0 citations62
US11539081B2Dec 27, 2022
Miniaturized electronics package with patterned thin film solid state battery
IBM0 citations62
US11311224B2Apr 26, 2022
Flexible silicon nanowire electrode
IBM0 citations62
US11222862B2Jan 11, 2022
High speed handling of ultra-small chips by selective laser bonding and debonding
IBM0 citations62
US11171374B2Nov 9, 2021
Thin film solid-state microbattery packaging
IBM0 citations62
US11165248B2Nov 2, 2021
Air gap metal tip electrostatic discharge protection
IBM0 citations62
US11133670B2Sep 28, 2021
Air gap metal tip electrostatic discharge protection
IBM0 citations62
US11119504B2Sep 14, 2021
Machine learning based airflow sensing for aircraft
IBM0 citations62
US11058337B2Jul 13, 2021
Flexible silicon nanowire electrode
IBM0 citations62
US11055459B2Jul 6, 2021
Heterogeneous miniaturization platform
IBM0 citations62
US10833296B2Nov 10, 2020
Thin film solid-state microbattery packaging
IBM1 citations62
US12300615B2May 13, 2025
Infrared debond damage mitigation by copper fill pattern
IBM0 citations61
US11522243B2Dec 6, 2022
Hermetic packaging of a micro-battery device
IBM0 citations61
US10964925B2Mar 30, 2021
Hermetial via seal for thin film battery
IBM0 citations60
US11101513B2Aug 24, 2021
Thin film battery packaging
IBM1 citations59
US11876233B2Jan 16, 2024
Thin film battery stacking
IBM0 citations52
US11710669B2Jul 25, 2023
Precision thin electronics handling integration
IBM0 citations52
US11094407B2Aug 17, 2021
Electronics miniaturization platform for medication verification and tracking
IBM0 citations52
US10784380B2Sep 22, 2020
Gate-all-around transistor based non-volatile memory devices
IBM0 citations52
US10658973B2May 19, 2020
Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tank
IBM0 citations52
US10651036B2May 12, 2020
Chip handling and electronic component integration
IBM0 citations52
US10651507B2May 12, 2020
Miniaturized electronics package with patterned thin film solid state battery
IBM0 citations52
US10637101B2Apr 28, 2020
Miniaturized electronics package with patterned thin film solid state battery
IBM0 citations52
US10610117B2Apr 7, 2020
Flexible silicon nanowire electrode
IBM0 citations52
US10586875B2Mar 10, 2020
Gate-all-around transistor based non-volatile memory devices
IBM0 citations52
US10505160B2Dec 10, 2019
Micro-battery using glass package
IBM0 citations52
US10407791B2Sep 10, 2019
Selective solder plating
IBM0 citations48
US10687425B2Jun 16, 2020
Method of forming a plurality of electro-optical module assemblies
IBM0 citations41
US10670656B2Jun 2, 2020
Integrated electro-optical module assembly
IBM0 citations41
US10638613B2Apr 28, 2020
Method of forming a plurality of electro-optical module assemblies
IBM0 citations41
US10393798B2Aug 27, 2019
Integrated electro-optical module assembly
IBM0 citations41
US10361140B2Jul 23, 2019
Wafer stacking for integrated circuit manufacturing
IBM0 citations40