Inventor

DANG BING

US142 patents

⚠️ This page may combine multiple inventors who share the name “DANG BING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DANG BING

IBM

Chip handling and electronic component integration

Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips

Package structures to improve on-chip antenna performance

Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies

Silicon carrier including an integrated heater for die rework and wafer probe

Integration of area efficient antennas for phased array or wafer scale array antenna applications

Integrated module for data processing system

High speed handling of ultra-small chips by selective laser bonding and debonding

Double layer release temporary bond and debond processes and systems

Wafer debonding using mid-wavelength infrared radiation ablation

Double layer release temporary bond and debond processes and systems

Magnetically guided chiplet displacement

Micro-LED array transfer

Wafer debonding using mid-wavelength infrared radiation ablation

Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit dies

Planarity-tolerant reworkable interconnect with integrated testing

Integrated module for data processing system

Integration of area efficient antennas for phased array or wafer scale array antenna applications

Thin, flexible microsystem with integrated energy source

Method of forming surface protrusions on an article and the article with the protrusions attached

Multi-sensor platform for health monitoring

Medical device system

Chip handling and electronic component integration

Handler bonding and debonding for semiconductor dies

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

IR assisted fan-out wafer level packaging using silicon handler

Chip handling and electronic component integration

Handler bonding and debonding for semiconductor dies

Magnetically guided chiplet displacement

Microchip medical substance delivery devices

Handler bonding and debonding for semiconductor dies

Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board

Handler bonding and debonding for semiconductor dies

Method and apparatus for laser dicing of wafers

Wafer level overmold for three dimensional surfaces

Delivery device including reactive material for programmable discrete delivery of a substance

Drug delivery device having a cavity sealed by a pressurized membrane

DANG BING

Self-sealed fluidic channels for nanopore array

Three dimensional flip chip system and method

Laser ablation of adhesive for integrated circuit fabrication

Method for forming integrated circuit assembly

Laser ablation for integrated circuit fabrication

Integrated circuit (IC) test probe

ANDRY PAUL S

Silicon carrier optoelectronic packaging

Silicon carrier optoelectronic packaging

Transferable probe tips

BARWICZ TYMON

Assembly of electronic and optical devices

Assembly of electronic and optical devices

GEORGIA TECH RES INST

3-D ICs with microfluidic interconnects and methods of constructing same

GLOBALFOUNDRIES INC

Wafer debonding using long-wavelength infrared radiation ablation