Inventor

BOIS KARL J

US31 patents

⚠️ This page may combine multiple inventors who share the name “BOIS KARL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOIS KARL J

HEWLETT PACKARD ENTPR DEV LP

Defected ground structure with void having resistive material along perimeter to improve EMI suppression

Bit error ratio tests with two-sided bit error ratio frequentist intervals

Bit error ratio tests

AC-coupling structure in electrical cabled interconnect

Methods and systems for exchange bus routing

Printed circuit board signal layer testing

Void avoidance verifications for electronic circuit designs

Defected ground structure to minimize EMI radiation

AC-coupling structure in electrical cabled interconnect

Methods and systems for transposition channel routing

Single ended vias with shared voids

Waveguide structures

Double stub transmission line for suppression of harmonics

Communication channel with tuning structure

Determining parameters of PCB structures

Printed circuit board capacitor structures

Power proximity verifications for electronic circuit designs

Symmetry verifications for differential signal vias of an electronic circuit design

HEWLETT PACKARD DEVELOPMENT CO

Differential via pair impedance adjustment tool

Signal via impedance verification tool

Signal line impedance adjustment tool

Signal line impedance verification tool

Signal via impedance adjustment tool

Printed circuit board including pads with vacancies

Differential line pair impedance verification tool

Differential via pair impedance verification tool

Differential line pair impedance adjustment tool

Systems and methods of synchronizing reference frequencies

Data bus with separate matched line impedances and method of matching line impedances

UNIV COLORADO STATE RES FOUND

Microwave determination related to a material such as chloride found in a cement based composition

BOIS KARL J

Use of hybrid PCB materials in printed circuit boards