Inventor

BENVEGNU DOMINIC J

US117 patents

⚠️ This page may combine multiple inventors who share the name “BENVEGNU DOMINIC J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BENVEGNU DOMINIC J

APPLIED MATERIALS INC

Spectrum based endpointing for chemical mechanical polishing

Substrate thickness measuring during polishing

Spectra based endpointing for chemical mechanical polishing

Spectrum based endpointing for chemical mechanical polishing

Endpointing detection for chemical mechanical polishing based on spectrometry

Substrate thickness measuring during polishing

Metrology for chemical mechanical polishing

Using optical metrology for within wafer feed forward process control

Peak-based endpointing for chemical mechanical polishing

Friction sensor for polishing system

Polishing pad assembly with glass or crystalline window

Polishing endpoint detection system and method using friction sensor

Determining physical property of substrate

Polishing pad assembly with glass or crystalline window

Sealed polishing pad, system and methods

Sealed polishing pad methods

Polishing pad with window

System using film thickness estimation from machine learning based processing of substrate images

Thickness measurement of substrate using color metrology

Limiting adjustment of polishing rates during substrate polishing

Adjustment of polishing rates during substrate polishing with predictive filters

Using spectra to determine polishing endpoints

Thin polishing pad with window and molding process

Reflectivity measurements during polishing using a camera

Weighted regression of thickness maps from spectral data

Semi-quantitative thickness determination

Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Semi-quantitative thickness determination

Friction sensor for polishing system

High throughput measurement system

Polishing pad with window having multiple portions

Methods and apparatus for generating a library of spectra

System with sealed polishing pad

Iso-reflectance wavelengths

Inductive monitoring of conductive trench depth

Method of making and apparatus having polishing pad with window

BENVEGNU DOMINIC J

Thin polishing pad with window and molding process

Polishing pad with partially recessed window

Methods and apparatus for measuring substrate edge thickness during polishing

Linear prediction for filtering of data during in-situ monitoring of polishing

Endpoint detection using spectrum feature trajectories

Method of controlling polishing using in-situ optical monitoring and fourier transform

DAVID JEFFREY DRUE

Using optical metrology for wafer to wafer feed back process control

Endpoint method using peak location of spectra contour plots versus time

Fitting of optical model to measured spectrum

Gathering spectra from multiple optical heads

Endpoint method using peak location of modified spectra

SWEDEK BOGUSLAW A

Spectra based endpointing for chemical mechanical polishing

Molding windows in thin pads

QIAN JUN

Polishing pad and system with window support