Inventor
CHO JAEYONG
US21 patents
⚠️ This page may combine multiple inventors who share the name “CHO JAEYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS10510575B2Dec 17, 2019
Substrate support with multiple embedded electrodes
APPLIED MATERIALS INC64 citations98
US10811296B2Oct 20, 2020
Substrate support with dual embedded electrodes
APPLIED MATERIALS INC43 citations94
US10714372B2Jul 14, 2020
System for coupling a voltage to portions of a substrate
APPLIED MATERIALS INC44 citations93
US11837479B2Dec 5, 2023
Advanced temperature control for wafer carrier in plasma processing chamber
APPLIED MATERIALS INC6 citations84
US11049755B2Jun 29, 2021
Semiconductor substrate supports with embedded RF shield
APPLIED MATERIALS INC8 citations80
US12198966B2Jan 14, 2025
Substrate support with multiple embedded electrodes
APPLIED MATERIALS INC2 citations75
US12300473B2May 13, 2025
Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber
APPLIED MATERIALS INC2 citations74
US11532497B2Dec 20, 2022
High power electrostatic chuck design with radio frequency coupling
APPLIED MATERIALS INC3 citations73
US11127619B2Sep 21, 2021
Workpiece carrier for high power with enhanced edge sealing
APPLIED MATERIALS INC2 citations73
US10937678B2Mar 2, 2021
Substrate support with multiple embedded electrodes
APPLIED MATERIALS INC2 citations73
US10770270B2Sep 8, 2020
High power electrostatic chuck with aperture-reducing plug in a gas hole
APPLIED MATERIALS INC2 citations73
US10504765B2Dec 10, 2019
Electrostatic chuck assembly having a dielectric filler
APPLIED MATERIALS INC2 citations72
US11948826B2Apr 2, 2024
High power electrostatic chuck design with radio frequency coupling
APPLIED MATERIALS INC0 citations62
US10930540B2Feb 23, 2021
Electrostatic chuck assembly having a dielectric filler
APPLIED MATERIALS INC0 citations62
US12272575B2Apr 8, 2025
Advanced temperature control for wafer carrier in plasma processing chamber
APPLIED MATERIALS INC0 citations61
US12562353B2Feb 24, 2026
Replaceable electrostatic chuck outer ring for edge arcing mitigation
APPLIED MATERIALS INC0 citations60
US11551916B2Jan 10, 2023
Sheath and temperature control of a process kit in a substrate processing chamber
APPLIED MATERIALS INC0 citations52
US11894255B2Feb 6, 2024
Sheath and temperature control of process kit
APPLIED MATERIALS INC0 citations51