Inventor

LEE HARRY Q

US83 patents

⚠️ This page may combine multiple inventors who share the name “LEE HARRY Q”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HARRY Q

APPLIED MATERIALS INC

Radially oscillating carousel processing system for chemical mechanical polishing

Continuous processing system for chemical mechanical polishing

Apparatus and method for simulating and optimizing a chemical mechanical polishing system

Substrate thickness measuring during polishing

Method and apparatus for using a retaining ring to control the edge effect

Carrier head design for a chemical mechanical polishing apparatus

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

System for chemical mechanical polishing having multiple polishing stations

Underwater wafer storage and wafer picking for chemical mechanical polishing

Method for automatically establishing a wafer coordinate system

Multiple-scan method for wafer particle analysis

Particle analysis of notched wafers

Substrate thickness measuring during polishing

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

Method for adjusting substrate processing times in a substrate polishing system

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

Using optical metrology for within wafer feed forward process control

Determining physical property of substrate

Method of particle analysis on a mirror wafer

Polishing apparatus using machine learning and compensation for pad thickness

Polishing apparatus using neural network for monitoring

Limiting adjustment of polishing rates during substrate polishing

Adjustment of polishing rates during substrate polishing with predictive filters

Using spectra to determine polishing endpoints

Semi-quantitative thickness determination

Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Semi-quantitative thickness determination

High throughput measurement system

Methods and apparatus for generating a library of spectra

Polishing apparatus having a trough

Determining physical property of substrate

Multi-platen multi-head polishing architecture

Profile control with multiple instances of contol algorithm during polishing

Switching control algorithms on detection of exposure of underlying layer during polishing

Using a trained neural network for use in in-situ monitoring during polishing and polishing system

Display of spectra contour plots versus time for semiconductor processing system control

Chattering correction for accurate sensor position determination on wafer

Endpoint method using peak location of spectra contour plots versus time

DAVID JEFFREY DRUE

Using optical metrology for wafer to wafer feed back process control

Spectrographic monitoring of a substrate during processing using index values

Endpoint method using peak location of spectra contour plots versus time

Dynamically tracking spectrum features for endpoint detection

Endpoint method using peak location of modified spectra

Tracking spectrum features in two dimensions for endpoint detection

QIAN JUN

Automatic generation of reference spectra for optical monitoring of substrates

Feedback for polishing rate correction in chemical mechanical polishing

Selecting reference libraries for monitoring of multiple zones on a substrate

TOLLES ROBERT D

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

ZHANG JIMIN

Detection of layer clearing using spectral monitoring

SHENDON NORMAN

Chemical mechanical polishing retaining ring