Inventor

FOURNEL FRANK

FR47 patents

⚠️ This page may combine multiple inventors who share the name “FOURNEL FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FOURNEL FRANK

COMMISSARIAT ENERGIE ATOMIQUE

Simplified method of producing an epitaxially grown structure

Method for separating wafers bonded together to form a stacked structure

Method for performing direct bonding between two structures

Manufacturing a flexible structure by transfers of layers

Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material

Method for fabricating a detection device comprising a step of transferring and direct bonding of a thin layer provided with a getter material

Method for direct bonding with self-alignment using ultrasound

Method of treatment of an electronic circuit for a hybrid molecular bonding

Method for manufacturing a handle substrate intended for temporary bonding of a substrate

Temporary bonding method with thermoplastic adhesive incorporating a rigid ring

Bonding method with electron-stimulated desorption

Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates

Method for bonding chips to a substrate by direct bonding

Method for transferring a layer from a source substrate to a destination substrate

Method for transferring thin layers

Method for producing a support for the growth of localised elongated nanostructures

Method for transferring chips

Temporary bonding method

Method for bonding by direct adhesion

Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer

Method for the collective production of a plurality of optoelectronic chips

Method for direct hydrophilic bonding of substrates

Direct bonding process

Method of producing a strained layer

Process for hydrophilically bonding substrates

Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water

Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate

LED emissive display device and method for producing such a device

Method of dismantling a stack of at least three substrates

Cationic elements-assisted direct bonding method

Thin-film transfer method

Method for bonding two hydrophilic surfaces

Method for nanostructuring of the surface of a substrate

Method for recycling a substrate holder

Method of transferring a thin film from a substrate to a flexible support

Method for manufacturing a handling device and method for reversible bonding using such a device

Method and device for checking a bond between two substrates

Method for manufacturing a handle substrate for the temporary bonding of a substrate

Double layer transfer method

Method for manufacturing a structure by direct bonding

FOURNEL FRANK

Method for building a substrate holder

Method for producing a substrate holder

COMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Method for transferring a layer from a source substrate to a destination substrate

BENEYTON REMI

Process for assembling substrates with low-temperature heat treatments

Commissariat à l'Energie Atomique et aux Energies Alternatives

Fabrication method of a stack of electronic devices

AMS AG

Semiconductor device and method for manufacturing a semiconductor device

CONSTANCIAS CHRISTOPHE

Method for making a planar membrane