Inventor
LI ZIHUI
US33 patents
⚠️ This page may combine multiple inventors who share the name “LI ZIHUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
31 patentsUS9991134B2Jun 5, 2018
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC100 citations99
US9704723B2Jul 11, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC125 citations99
US9449850B2Sep 20, 2016
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC135 citations99
US9412608B2Aug 9, 2016
Dry-etch for selective tungsten removal
APPLIED MATERIALS INC134 citations99
US9209012B2Dec 8, 2015
Selective etch of silicon nitride
APPLIED MATERIALS INC173 citations99
US9184055B2Nov 10, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC220 citations99
US9093371B2Jul 28, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC187 citations99
US8980763B2Mar 17, 2015
Dry-etch for selective tungsten removal
APPLIED MATERIALS INC206 citations99
US8956980B1Feb 17, 2015
Selective etch of silicon nitride
APPLIED MATERIALS INC226 citations99
US9831097B2Nov 28, 2017
Methods for selective etching of a silicon material using HF gas without nitrogen etchants
APPLIED MATERIALS INC100 citations98
US9502258B2Nov 22, 2016
Anisotropic gap etch
APPLIED MATERIALS INC129 citations98
US9406523B2Aug 2, 2016
Highly selective doped oxide removal method
APPLIED MATERIALS INC135 citations98
US9881805B2Jan 30, 2018
Silicon selective removal
APPLIED MATERIALS INC110 citations97
US10319600B1Jun 11, 2019
Thermal silicon etch
APPLIED MATERIALS INC34 citations94
US11637002B2Apr 25, 2023
Methods and systems to enhance process uniformity
APPLIED MATERIALS INC4 citations74
US10204796B2Feb 12, 2019
Methods for selective etching of a silicon material using HF gas without nitrogen etchants
APPLIED MATERIALS INC2 citations73
US10170336B1Jan 1, 2019
Methods for anisotropic control of selective silicon removal
APPLIED MATERIALS INC4 citations73
US10249507B2Apr 2, 2019
Methods for selective etching of a silicon material
APPLIED MATERIALS INC2 citations72
US9653310B1May 16, 2017
Methods for selective etching of a silicon material
APPLIED MATERIALS INC3 citations72
US11004689B2May 11, 2021
Thermal silicon etch
APPLIED MATERIALS INC0 citations63
US11239061B2Feb 1, 2022
Methods and systems to enhance process uniformity
APPLIED MATERIALS INC0 citations62
US10573527B2Feb 25, 2020
Gas-phase selective etching systems and methods
APPLIED MATERIALS INC1 citations62
US11764058B2Sep 19, 2023
Three-color 3D DRAM stack and methods of making
APPLIED MATERIALS INC0 citations61
US12334358B2Jun 17, 2025
Integration processes utilizing boron-doped silicon materials
APPLIED MATERIALS INC0 citations58
US12431360B2Sep 30, 2025
Selective etching between silicon-and-germanium-containing materials with varying germanium concentrations
APPLIED MATERIALS INC0 citations52
US12394631B2Aug 19, 2025
Selective etching of silicon-and-germanium-containing materials with increased surface purities
APPLIED MATERIALS INC0 citations52
US12575360B2Mar 10, 2026
Semiconductor processing chamber adapter
APPLIED MATERIALS INC0 citations51
US10497573B2Dec 3, 2019
Selective atomic layer etching of semiconductor materials
APPLIED MATERIALS INC0 citations51