Inventor

TENG PO-YUAN

TW38 patents

⚠️ This page may combine multiple inventors who share the name “TENG PO-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TENG PO-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and manufacturing method thereof

Package structure and method of manufacturing the same

Chip package structure including a silicon substrate interposer and methods for forming the same

Packages with thick RDLs and thin RDLs stacked alternatingly

Integrated circuit package and method

Package structure and manufacturing method of package structure thereof

Semiconductor device having a heat dissipation structure connected chip package

Package structure and method of manufacturing the same

Semiconductor device including heat dissipation structure and fabricating method of the same

Integrated circuit package and method

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method of semiconductor package

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device, circuit board structure and manufacturing method thereof

Packages with thick RDLs and thin RDLs stacked alternatingly

Semiconductor device, circuit board structure and manufacturing method thereof

Semiconductor device, circuit board structure and manufacturing method thereof

Package structure and method of forming the same

Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark

Integrated circuit package and method

Semiconductor device having a heat dissipation structure connected chip package

Package structure and manufacturing method of package structure thereof

Chip package structure including a silicon substrate interposer and methods for forming the same

Integrated circuit packages having support rings

Semiconductor device including heat dissipation structure and fabricating method of the same

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method of semiconductor package

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method of semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device

TENG PO-YUAN

Multi-level data encryption and decryption system and method thereof

Chemical vapor deposition of graphene on dielectrics

TREND MICRO INC

Detection of business email compromise attacks

UNIV NAT TSING HUA

Graphene manufacturing method

NAT UNIV TSING HUA

Layer by layer removal of graphene layers