Inventor

GOH ENG HUAT

MY72 patents

⚠️ This page may combine multiple inventors who share the name “GOH ENG HUAT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOH ENG HUAT

INTEL CORP

Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer

Interconnects with interlocks

Combination stiffener and capacitor

Floating-bridge interconnects and methods of assembling same

Integrated circuit package with microstrip routing and an external ground plane

Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus

Microelectronic device package electromagnetic shield

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

Dynamic random access memory (DRAM) mounts

Foldable fabric-based packaging solution

Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias

Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

Electromagnetic interference (EMI) shield for circuit card assembly (CCA)

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

Method and apparatus for reducing electrical interconnection fatigue

Board to board interconnect

Board to board interconnect

Apparatus utilizing computer on package construction

Flexible shield for semiconductor devices

Interconnects with interlocks

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package

Wrappable EMI shields

Reverse-bridge multi-die interconnect for integrated-circuit packages

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

RFI free picture frame metal stiffener

Disaggregated die interconnection with on-silicon cavity bridge

Electronic device package on package (POP)

Slot antenna on a printed circuit board (PCB)

Floating-bridge interconnects and methods of assembling same

Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package

Slot antenna on a printed circuit board (PCB)

Semiconductor package having integrated stiffener region

Extended stiffener for platform miniaturization

Reduced-height electronic memory system and method

Integrated circuit packages with on package memory architectures

Co-planar interconnection mechanisms for circuit boards

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Multi-use package architecture

Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

Multi-planar circuit board having reduced z-height

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Electronic package with passive component between substrates

Board to board interconnect

Electronic package with passive component between substrates

Electrically conductive strips on a side of a memory module

Extended package air core inductor

TAY CHENG SIEW

Method and apparatus for reducing electrical interconnection fatigue

GOH ENG HUAT

Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias