Inventor
HOE WEE
MY5 patents
Patents
5 patentsUS10388636B2Aug 20, 2019
Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
INTEL CORP3 citations71
US12002793B2Jun 4, 2024
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
INTEL CORP0 citations61
US11114421B2Sep 7, 2021
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
INTEL CORP0 citations61
US11096284B2Aug 17, 2021
Compact semiconductor chip system and method
INTEL CORP0 citations55
US9831693B2Nov 28, 2017
Techniques for serial interface charging
INTEL CORP1 citations44