Inventor
YONG KHANG CHOONG
MY55 patents
⚠️ This page may combine multiple inventors who share the name “YONG KHANG CHOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
49 patentsUS10386941B2Aug 20, 2019
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP5 citations83
US10796999B2Oct 6, 2020
Floating-bridge interconnects and methods of assembling same
INTEL CORP4 citations73
US10158339B2Dec 18, 2018
Capacitive compensation structures using partially meshed ground planes
INTEL CORP2 citations73
US10153253B2Dec 11, 2018
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
INTEL CORP2 citations73
US10085342B2Sep 25, 2018
Microelectronic device having an air core inductor
INTEL CORP6 citations73
US9836095B1Dec 5, 2017
Microelectronic device package electromagnetic shield
INTEL CORP6 citations73
US10996773B2May 4, 2021
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP3 citations72
US10516366B2Dec 24, 2019
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP3 citations71
US10388636B2Aug 20, 2019
Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
INTEL CORP3 citations71
US10171033B2Jan 1, 2019
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP2 citations71
USD788626SJun 6, 2017
Smartwatch
INTEL CORP5 citations71
US10772206B2Sep 8, 2020
Board to board interconnect
INTEL CORP1 citations70
US10356902B2Jul 16, 2019
Board to board interconnect
INTEL CORP3 citations70
US10079158B2Sep 18, 2018
Vertical trench routing in a substrate
INTEL CORP3 citations69
US10701796B2Jun 30, 2020
Electromagnetic interference (EMI) shield
INTEL CORP2 citations66
US11177226B2Nov 16, 2021
Flexible shield for semiconductor devices
INTEL CORP0 citations63
US11658127B2May 23, 2023
RFI free picture frame metal stiffener
INTEL CORP1 citations62
US11652057B2May 16, 2023
Disaggregated die interconnection with on-silicon cavity bridge
INTEL CORP0 citations62
US11552403B2Jan 10, 2023
Slot antenna on a printed circuit board (PCB)
INTEL CORP0 citations62
US11393760B2Jul 19, 2022
Floating-bridge interconnects and methods of assembling same
INTEL CORP0 citations62
US11211714B2Dec 28, 2021
Slot antenna on a printed circuit board (PCB)
INTEL CORP0 citations62
US10643983B2May 5, 2020
Extended stiffener for platform miniaturization
INTEL CORP1 citations62
US12002793B2Jun 4, 2024
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
INTEL CORP0 citations61
US11422642B2Aug 23, 2022
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations61
US11290059B2Mar 29, 2022
Crystal oscillator interconnect architecture with noise immunity
INTEL CORP0 citations61
US11114421B2Sep 7, 2021
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
INTEL CORP0 citations61
US11061492B2Jul 13, 2021
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations61
US11955436B2Apr 9, 2024
Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission
INTEL CORP0 citations60
US11304299B2Apr 12, 2022
Board to board interconnect
INTEL CORP0 citations60
US11729900B2Aug 15, 2023
Pattern-edged metal-plane resonance-suppression
INTEL CORP0 citations59
US11277903B2Mar 15, 2022
Pattern-edged metal-plane resonance-suppression
INTEL CORP1 citations59
US11614811B2Mar 28, 2023
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations57
US10971440B2Apr 6, 2021
Semiconductor package having an impedance-boosting channel
INTEL CORP0 citations55
US11798894B2Oct 24, 2023
Devices and methods for signal integrity protection technique
INTEL CORP0 citations52
US11178768B2Nov 16, 2021
Flexible printed circuit EMI enclosure
INTEL CORP0 citations52
US10652999B2May 12, 2020
Mutual inductance suppressor for crosstalk immunity enhancement
INTEL CORP0 citations52
US10396834B2Aug 27, 2019
Apparatus and method for adaptive common mode noise decomposition and tuning
INTEL CORP0 citations52
US10256519B2Apr 9, 2019
Stranded transmission line and uses thereof
INTEL CORP0 citations52
US10083922B2Sep 25, 2018
Inductor interconnect
INTEL CORP1 citations52
US9489333B2Nov 8, 2016
Adaptive termination scheme for low power high speed bus
INTEL CORP0 citations52
US9455752B2Sep 27, 2016
Apparatus and method for adaptive common mode noise decomposition and tuning
INTEL CORP1 citations52
US10973116B2Apr 6, 2021
3D high-inductive ground plane for crosstalk reduction
INTEL CORP0 citations51
US9552995B2Jan 24, 2017
Electrical interconnect for an electronic package
INTEL CORP0 citations51
US9606949B1Mar 28, 2017
Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling
INTEL CORP1 citations50
US10484231B2Nov 19, 2019
Routing-over-void-T-line-compensation
INTEL CORP0 citations49
US11153968B2Oct 19, 2021
Device, system and method to promote the integrity of signal communications
INTEL CORP0 citations48
US10354957B2Jul 16, 2019
Electrical interconnect for a flexible electronic package
INTEL CORP0 citations48
US10108227B2Oct 23, 2018
Techniques for providing an interface component for a wearable device
INTEL CORP1 citations48
US10734333B2Aug 4, 2020
Semiconductor package having inductive lateral interconnects
INTEL CORP0 citations47
MOLEX LLC
1 patentShowing the top 50 of 55 patents by PatentIndex Score.