P

Inventor

YONG KHANG CHOONG

MY55 patents
⚠️ This page may combine multiple inventors who share the name “YONG KHANG CHOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

49 patents
US10386941B2Aug 20, 2019

Gyratory sensing system to enhance wearable device user experience via HMI extension

INTEL CORP5 citations83
US10796999B2Oct 6, 2020

Floating-bridge interconnects and methods of assembling same

INTEL CORP4 citations73
US10158339B2Dec 18, 2018

Capacitive compensation structures using partially meshed ground planes

INTEL CORP2 citations73
US10153253B2Dec 11, 2018

Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus

INTEL CORP2 citations73
US10085342B2Sep 25, 2018

Microelectronic device having an air core inductor

INTEL CORP6 citations73
US9836095B1Dec 5, 2017

Microelectronic device package electromagnetic shield

INTEL CORP6 citations73
US10996773B2May 4, 2021

Gyratory sensing system to enhance wearable device user experience via HMI extension

INTEL CORP3 citations72
US10516366B2Dec 24, 2019

Crystal oscillator interconnect architecture with noise immunity

INTEL CORP3 citations71
US10388636B2Aug 20, 2019

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

INTEL CORP3 citations71
US10171033B2Jan 1, 2019

Crystal oscillator interconnect architecture with noise immunity

INTEL CORP2 citations71
USD788626SJun 6, 2017

Smartwatch

INTEL CORP5 citations71
US10772206B2Sep 8, 2020

Board to board interconnect

INTEL CORP1 citations70
US10356902B2Jul 16, 2019

Board to board interconnect

INTEL CORP3 citations70
US10079158B2Sep 18, 2018

Vertical trench routing in a substrate

INTEL CORP3 citations69
US10701796B2Jun 30, 2020

Electromagnetic interference (EMI) shield

INTEL CORP2 citations66
US11177226B2Nov 16, 2021

Flexible shield for semiconductor devices

INTEL CORP0 citations63
US11658127B2May 23, 2023

RFI free picture frame metal stiffener

INTEL CORP1 citations62
US11652057B2May 16, 2023

Disaggregated die interconnection with on-silicon cavity bridge

INTEL CORP0 citations62
US11552403B2Jan 10, 2023

Slot antenna on a printed circuit board (PCB)

INTEL CORP0 citations62
US11393760B2Jul 19, 2022

Floating-bridge interconnects and methods of assembling same

INTEL CORP0 citations62
US11211714B2Dec 28, 2021

Slot antenna on a printed circuit board (PCB)

INTEL CORP0 citations62
US10643983B2May 5, 2020

Extended stiffener for platform miniaturization

INTEL CORP1 citations62
US12002793B2Jun 4, 2024

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

INTEL CORP0 citations61
US11422642B2Aug 23, 2022

Gyratory sensing system to enhance wearable device user experience via HMI extension

INTEL CORP0 citations61
US11290059B2Mar 29, 2022

Crystal oscillator interconnect architecture with noise immunity

INTEL CORP0 citations61
US11114421B2Sep 7, 2021

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

INTEL CORP0 citations61
US11061492B2Jul 13, 2021

Gyratory sensing system to enhance wearable device user experience via HMI extension

INTEL CORP0 citations61
US11955436B2Apr 9, 2024

Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission

INTEL CORP0 citations60
US11304299B2Apr 12, 2022

Board to board interconnect

INTEL CORP0 citations60
US11729900B2Aug 15, 2023

Pattern-edged metal-plane resonance-suppression

INTEL CORP0 citations59
US11277903B2Mar 15, 2022

Pattern-edged metal-plane resonance-suppression

INTEL CORP1 citations59
US11614811B2Mar 28, 2023

Gyratory sensing system to enhance wearable device user experience via HMI extension

INTEL CORP0 citations57
US10971440B2Apr 6, 2021

Semiconductor package having an impedance-boosting channel

INTEL CORP0 citations55
US11798894B2Oct 24, 2023

Devices and methods for signal integrity protection technique

INTEL CORP0 citations52
US11178768B2Nov 16, 2021

Flexible printed circuit EMI enclosure

INTEL CORP0 citations52
US10652999B2May 12, 2020

Mutual inductance suppressor for crosstalk immunity enhancement

INTEL CORP0 citations52
US10396834B2Aug 27, 2019

Apparatus and method for adaptive common mode noise decomposition and tuning

INTEL CORP0 citations52
US10256519B2Apr 9, 2019

Stranded transmission line and uses thereof

INTEL CORP0 citations52
US10083922B2Sep 25, 2018

Inductor interconnect

INTEL CORP1 citations52
US9489333B2Nov 8, 2016

Adaptive termination scheme for low power high speed bus

INTEL CORP0 citations52
US9455752B2Sep 27, 2016

Apparatus and method for adaptive common mode noise decomposition and tuning

INTEL CORP1 citations52
US10973116B2Apr 6, 2021

3D high-inductive ground plane for crosstalk reduction

INTEL CORP0 citations51
US9552995B2Jan 24, 2017

Electrical interconnect for an electronic package

INTEL CORP0 citations51
US9606949B1Mar 28, 2017

Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling

INTEL CORP1 citations50
US10484231B2Nov 19, 2019

Routing-over-void-T-line-compensation

INTEL CORP0 citations49
US11153968B2Oct 19, 2021

Device, system and method to promote the integrity of signal communications

INTEL CORP0 citations48
US10354957B2Jul 16, 2019

Electrical interconnect for a flexible electronic package

INTEL CORP0 citations48
US10108227B2Oct 23, 2018

Techniques for providing an interface component for a wearable device

INTEL CORP1 citations48
US10734333B2Aug 4, 2020

Semiconductor package having inductive lateral interconnects

INTEL CORP0 citations47

MOLEX LLC

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.