Inventor

OOI PING PING

MY18 patents

⚠️ This page may combine multiple inventors who share the name “OOI PING PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OOI PING PING

INTEL CORP

Substrate with gradiated dielectric for reducing impedance mismatch

Packaged die stacks with stacked capacitors and methods of assembling same

Over-molded IC package with in-mold capacitor

Packaged die stacks with stacked capacitors and methods of assembling same

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

Apparatus utilizing computer on package construction

Composite bridge die-to-die interconnects for integrated-circuit packages

Substrate with gradiated dielectric for reducing impedance mismatch

Composite bridge die-to-die interconnects for integrated-circuit packages

Interconnect core

Multi-conductor interconnect structure for a microelectronic device

Stacked dice systems

Stacked package assembly with voltage reference plane

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Over-molded IC packages with embedded voltage reference plane and heater spreader

Hybrid package transmission line circuits

KONG CHUNG PENG JACKSON

Hybrid package transmission line circuits