Inventor

HADA GAURAV

IN2 patents

Patents

2 patents

US12025971B2Jul 2, 2024

Socket interposer for system-in-package (SIP) module qualification in product platform validation (PPV) setup

INTEL CORP0 citations55

US12300918B2May 13, 2025

Memory module connector for thin computing systems

INTEL CORP0 citations53