Inventor

THEIL JEREMY ALFRED

US21 patents

⚠️ This page may combine multiple inventors who share the name “THEIL JEREMY ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

THEIL JEREMY ALFRED

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Molded direct bonded and interconnected stack

Molded direct bonded and interconnected stack

Molded direct bonded and interconnected stack

Interconnect structures

Low temperature bonded structures

Method for preparing a surface for direct-bonding

Chemical mechanical polishing for hybrid bonding

Low temperature bonded structures

Low temperature bonded structures

Interconnect structures

Low temperature bonded structures

Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface

Method for preparing a surface for direct-bonding

INVENSAS BONDING TECH INC

Molded direct bonded and interconnected stack

Low temperature bonded structures

Interconnect structures

Bonding surfaces for microelectronics

Chemical mechanical polishing for hybrid bonding

Low temperature bonded structures

AVAGO TECHNOLOGIES WIRELESS IP

Scented material dispense system for a hand-held device

ADEIA SEMICONDUCTOR BONDING TECH INC

System and method for bonding transparent conductor substrates