Inventor · disambiguated record
Byungkeun Kang
Also filed as: KANG BYUNGKEUN
1 granted patent·2 pending applications·0 citations·filing 2023–2025
13Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0165US12341124B2Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0264US2025309185A1Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0347US2024049400A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →