Inventor

LIANG STEVE XIN

CN3 patents

⚠️ This page may combine multiple inventors who share the name “LIANG STEVE XIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIANG STEVE XIN

1 patent

US8900931B2Dec 2, 2014

In-situ cavity integrated circuit package

LIANG STEVE XIN19 citations83

SKYWORKS SOLUTIONS INC

1 patent

US7642135B2Jan 5, 2010

Thermal mechanical flip chip die bonding

SKYWORKS SOLUTIONS INC13 citations78

JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD

1 patent

US9640413B2May 2, 2017

Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof

JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD1 citations40