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Inventor
TAI CHEN-YIN
TW
2 patents
Patents
2 patents
US9484313B2
Nov 1, 2016
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG
10 citations
81
US9984983B2
May 29, 2018
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG
5 citations
70