Inventor
CHIEN FENG-LUNG
TW20 patents
⚠️ This page may combine multiple inventors who share the name “CHIEN FENG-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK TAIWAN CORP
12 patentsUS9595383B2Mar 14, 2017
Wireless charging coil PCB structure
TDK TAIWAN CORP3 citations68
US12160112B2Dec 3, 2024
Wireless transmission module
TDK TAIWAN CORP2 citations67
US9793743B2Oct 17, 2017
Wireless charging device for charging a plurality of wireless power receiving apparatus and charging method thereof
TDK TAIWAN CORP3 citations65
US11936198B2Mar 19, 2024
Coil module
TDK TAIWAN CORP0 citations61
US11050298B2Jun 29, 2021
Wireless device
TDK TAIWAN CORP1 citations61
US12224108B2Feb 11, 2025
Coil module
TDK TAIWAN CORP0 citations52
US11817253B2Nov 14, 2023
Coil module
TDK TAIWAN CORP0 citations52
US12506366B2Dec 23, 2025
Wireless transmission module
TDK TAIWAN CORP0 citations49
US11581132B2Feb 14, 2023
Magnetic conductive substrate and coil assembly
TDK TAIWAN CORP0 citations49
US10615629B2Apr 7, 2020
Wireless device
TDK TAIWAN CORP0 citations49
US10855108B2Dec 1, 2020
Wireless device
TDK TAIWAN CORP0 citations38
US10840738B2Nov 17, 2020
Wireless device
TDK TAIWAN CORP0 citations38
SILICONWARE PRECISION INDUSTRIES CO LTD
6 patentsUS6348401B1Feb 19, 2002
Method of fabricating solder bumps with high coplanarity for flip-chip application
SILICONWARE PRECISION INDUSTRIES CO LTD38 citations90
US6753609B2Jun 22, 2004
Circuit probing contact pad formed on a bond pad in a flip chip package
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations84
US7489037B2Feb 10, 2009
Semiconductor device and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD15 citations82
US6692629B1Feb 17, 2004
Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer
SILICONWARE PRECISION INDUSTRIES CO LTD16 citations81
US7341949B2Mar 11, 2008
Process for forming lead-free bump on electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD11 citations74
US8569162B2Oct 29, 2013
Conductive bump structure on substrate and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations73