Inventor

LIN TZU-HUNG

TW101 patents

⚠️ This page may combine multiple inventors who share the name “LIN TZU-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN TZU-HUNG

MEDIATEK INC

Semiconductor package structure

Semiconductor package structure with antenna

Fan-out package structure with integrated antenna

Semiconductor package structure

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package

Fan-out package structure and method for forming the same

Semiconductor package assembly with embedded IPD

Semiconductor package

Semiconductor chip package assembly with improved heat dissipation performance

Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same

Semiconductor package structure and method for forming the same

Semiconductor package assembly

Semiconductor package assemblies with system-on-chip (SOC) packages

Semiconductor package structure and method for forming the same

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package with solder resist capped trace to prevent underfill delamination

Semiconductor package assembly with through silicon via interconnect

Semiconductor package structure

Fan-out package structure with integrated antenna

Semiconductor package structure having an annular frame with truncated corners

Semiconductor package structure with antenna

Chip scale package structure and method of forming the same

Semiconductor package structure

Semiconductor package structure having an annular frame with truncated corners

Flip chip package utilizing trace bump trace interconnection

Semiconductor package with antenna and fabrication method thereof

Package structure

Flip chip package utilizing trace bump trace interconnection

Stacked fan-out package structure

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor package assembly and method for forming the same

Semiconductor package assembly and method for forming the same

Semiconductor package assemblies with system-on-chip (SOC) packages

Flip chip package utilizing trace bump trace interconnection

Semiconductor package assembly

Semiconductor package assembly

Semiconductor package assembly

Semiconductor package assembly

Semiconductor structure

Semiconductor package

Semiconductor package structure

Semiconductor package

Semiconductor package with trace covered by solder resist

LIN TZU-HUNG

Semiconductor package

Flip chip package utilizing trace bump trace interconnection

MEDIATEK SINGAPORE PTE LTD

Chip package

CHAN KUEI-TI

Semiconductor package

GREGORICH THOMAS MATTHEW

Integrated circuit package structure