Inventor

PENG I-HSUAN

TW54 patents

⚠️ This page may combine multiple inventors who share the name “PENG I-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PENG I-HSUAN

MEDIATEK INC

Semiconductor package structure

Semiconductor package structure

Fan-out package structure and method for forming the same

Semiconductor package assembly with embedded IPD

Semiconductor chip package assembly with improved heat dissipation performance

Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same

Semiconductor package structure and method for forming the same

Semiconductor package assembly

Semiconductor package with dummy MIM capacitor die

Semiconductor package structure

Semiconductor chip package and fabrication method thereof

Semiconductor package structure having an annular frame with truncated corners

Semiconductor package with dummy MIM capacitor die

Semiconductor chip package and fabrication method thereof

Semiconductor package structure

Semiconductor package structure having an annular frame with truncated corners

Stacked fan-out package structure

Semiconductor package assembly and method for forming the same

Semiconductor package assembly and method for forming the same

Semiconductor package assembly

Semiconductor package assembly

Semiconductor package assembly

Electronic package with rotated semiconductor die

Semiconductor package having a stiffener ring

Electronic package with rotated semiconductor die

Semiconductor package structure and method for forming the same

Semiconductor package structure

Semiconductor package structure having an annular frame with truncated corners

Semiconductor package structure

Semiconductor package assembly having a conductive electromagnetic shield layer

Semiconductor package including lid structure with opening and recess

Semiconductor package structure

Semiconductor package including lid structure with opening and recess

Semiconductor package assembly and method for forming the same

Semiconductor package assembly

Semiconductor package assembly

Electronic package with rotated semiconductor die

Semiconductor package structure

Semiconductor package structure

Semiconductor package structure

Semiconductor package assembly

Semiconductor package with improved bandwidth

IND TECH RES INST

Stacked package for electronic elements and packaging method thereof

Packaging structure and method of an image sensor module

Packaging structure and method of an image sensor module

Method for fabricating polysilicon film

LIN JING-CHENG

Semiconductor device packaging methods and structures thereof

CHEN YEN-WEN

Display system and method

TAIWAN SEMICONDUCTOR MFG CO LTD

Underfill dispensing in 3D IC using metrology

MEDIA TEK INC

Semiconductor package having a stiffener ring