Inventor

LIU NAI-WEI

TW46 patents

⚠️ This page may combine multiple inventors who share the name “LIU NAI-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU NAI-WEI

MEDIATEK INC

Semiconductor package structure

Semiconductor package structure with antenna

Fan-out package structure with integrated antenna

Semiconductor package structure

Fan-out package structure and method for forming the same

Semiconductor package having an interposer in which one or more dies are formed and method of forming the same

Semiconductor package structure

Fan-out package structure with integrated antenna

Semiconductor package structure with antenna

Chip scale package structure and method of forming the same

Semiconductor package with antenna and fabrication method thereof

Stacked fan-out package structure

Semiconductor package structure

Semiconductor package structure including antenna

Chip scale package structure and method of forming the same

Semiconductor package assembly having a conductive electromagnetic shield layer

Semiconductor package including lid structure with opening and recess

Innovative air gap for antenna fan out package

Semiconductor package structure including antenna

Semiconductor package including lid structure with opening and recess

Semiconductor package assembly

Chip scale package structure and method of forming the same

Semiconductor package assembly

Semiconductor package with improved bandwidth

Fan-out package structure having embedded package substrate

TAIWAN SEMICONDUCTOR MFG CO LTD

Fan-out PoP structure with inconsecutive polymer layer

Interconnect structure for wafer level package

Fan-out package and methods of forming thereof

Semiconductor package device and manufacturing method thereof

Fan-out POP structure with inconsecutive polymer layer

PoP device

Semiconductor package device and manufacturing method thereof

Fan-out package and methods of forming thereof

PoP device

Fan-out package and methods of forming thereof

Semiconductor package device

Fan-out package and methods of forming thereof

TAIWAN SEMICONDUCTOR MFG

Interconnect structure for wafer level package

Method of making a semiconductor device including barrier layers for copper interconnect

Method of packaging a semiconductor device

Method and apparatus for a conductive pillar structure

Method and apparatus for a conductive pillar structure

YU CHEN-HUA

Interconnect structure for wafer level package

HUNG JUI-PIN

Packaging methods and structures using a die attach film

LIN JING-CHENG

Packaged semiconductor device with a molding compound and a method of forming the same

LIU NAI-WEI

Barrier layers for copper interconnect