Inventor

HUANG WEI-CHE

TW31 patents

⚠️ This page may combine multiple inventors who share the name “HUANG WEI-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG WEI-CHE

MEDIATEK INC

Fan-out package structure and method for forming the same

Semiconductor package structure and method for forming the same

Semiconductor package with through silicon via interconnect

Semiconductor package assembly with through silicon via interconnect

Package structure

Stacked fan-out package structure

Semiconductor package assembly

Semiconductor package with through silicon via interconnect and method for fabricating the same

Manufacturing method of semiconductor chip

Semiconductor chip and manufacturing method thereof

Package structure

Semiconductor package assembly having a conductive electromagnetic shield layer

Package structure

Semiconductor package assembly

Passive device cell and fabrication process thereof

Radio-frequency device package and method for fabricating the same

Semiconductor chip

Semiconductor package assembly

Semiconductor package assembly

Semiconductor package with improved bandwidth

Semiconductor package structure and method for forming the same

Semiconductor package with through silicon via interconnect

Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same

Passive device cell and fabrication process thereof

Radio-frequency device package and method for fabricating the same

Radio-frequency device package and method for fabricating the same

Fan-out package structure having embedded package substrate

Semiconductor package assembly with through silicon via interconnect

UNITED MICROELECTRONICS CORP

Method of cleaning the polymer from within holes on a semiconductor wafer

Method for forming a contact hole on a semiconductor wafer

HUNG CHENG-CHOU

Integrated circuit transformer