Inventor

CHOU CHE-YA

TW29 patents

⚠️ This page may combine multiple inventors who share the name “CHOU CHE-YA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOU CHE-YA

MEDIATEK INC

Semiconductor package structure and method for forming the same

Fan-out semiconductor package with copper pillar bumps

Semiconductor package having discrete antenna device

Semiconductor package using flip-chip technology

Semiconductor package with layer structures, antenna layer and electronic component

Semiconductor package

Semiconductor package assembly with passive device

Semiconductor device and wafer level package including such semiconductor device

Fan-out package structure having stacked carrier substrates and method for forming the same

Fan-out package structure

Semiconductor package incorporating redistribution layer interposer

Semiconductor package using flip-chip technology

Semiconductor device

Semiconductor package with layer structures, antenna layer and electronic component

Semiconductor package assembly having a conductive electromagnetic shield layer

Semiconductor package assembly

Semiconductor device and wafer level package including such semiconductor device

Semiconductor package having discrete antenna device

Semiconductor package assembly

Enhanced flip chip structure using copper column interconnect

Semiconductor package

Semiconductor package assembly with passive device

Semiconductor package assembly

Semiconductor package assembly

System-in-package and fabrication method thereof

ADVANCED SEMICONDUCTOR ENG

Structure of package on package and method for fabricating the same

Contact sensor package

GREGORICH THOMAS MATTHEW

Enhanced flip chip structure using copper column interconnect

ASE SHANGHAI INC

Packaging substrate and manufacturing method thereof