Inventor
TENDOU KAZUYOSHI
JP3 patents
Patents
3 patentsUS7675185B2Mar 9, 2010
Epoxy resin molding material for sealing and electronic component
HITACHI CHEMICAL CO LTD20 citations89
US7981977B2Jul 19, 2011
Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
HITACHI CHEMICAL CO LTD6 citations60
US7982322B2Jul 19, 2011
Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same
HITACHI CHEMICAL CO LTD0 citations49