Inventor
HSU SEN-KUEI
TW41 patents
Patents
41 patentsUS10490479B1Nov 26, 2019
Packaging of semiconductor device with antenna and heat spreader
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US11444023B2Sep 13, 2022
Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11296067B2Apr 5, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10840197B2Nov 17, 2020
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10818588B2Oct 27, 2020
Semiconductor device, package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10818651B2Oct 27, 2020
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9406648B2Aug 2, 2016
Power supply arrangement for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US12266648B2Apr 1, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11942442B2Mar 26, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12021024B2Jun 25, 2024
Semiconductor device including a semiconductor die and a plurality of antenna patterns
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11824054B2Nov 21, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11532576B2Dec 20, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11355466B2Jun 7, 2022
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322453B2May 3, 2022
Semiconductor package having channels formed between through-insulator-vias
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10937734B2Mar 2, 2021
Conductive traces in semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10872842B2Dec 22, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748831B2Aug 18, 2020
Semiconductor packages having thermal through vias (TTV)
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9899982B2Feb 20, 2018
On-chip electromagnetic bandgap (EBG) structure for noise suppression
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9653406B2May 16, 2017
Conductive traces in semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9891266B2Feb 13, 2018
Test circuit and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12451426B2Oct 21, 2025
Conductive traces in semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11894299B2Feb 6, 2024
Conductive traces in semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11631993B2Apr 18, 2023
Wireless charging devices having wireless charging coils and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12424571B2Sep 23, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362275B2Jul 15, 2025
Method of fabricating package structure including a plurality of antenna patterns
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051666B2Jul 30, 2024
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12014992B2Jun 18, 2024
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508666B2Nov 22, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11373922B2Jun 28, 2022
Semiconductor packages having thermal through vias (TTV)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11852672B2Dec 26, 2023
Test circuit and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11467203B2Oct 11, 2022
Test circuit and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11249112B2Feb 15, 2022
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10867882B2Dec 15, 2020
Semiconductor package, semiconductor device and method for packaging semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10720788B2Jul 21, 2020
Wireless charging devices having wireless charging coils and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10256203B2Apr 9, 2019
Semiconductor device and semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157859B2Dec 18, 2018
Semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9875972B1Jan 23, 2018
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10725090B2Jul 28, 2020
Test circuit and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10718790B2Jul 21, 2020
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10274518B2Apr 30, 2019
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9354254B2May 31, 2016
Test-yield improvement devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50