Inventor
HWANG HYEON
KR8 patents
⚠️ This page may combine multiple inventors who share the name “HWANG HYEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS7494845B2Feb 24, 2009
Method of forming a thin wafer stack for a wafer level package
SAMSUNG ELECTRONICS CO LTD247 citations97
US7294531B2Nov 13, 2007
Wafer level chip stack method
SAMSUNG ELECTRONICS CO LTD44 citations91
US6946328B2Sep 20, 2005
Method for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD17 citations83
US11862603B2Jan 2, 2024
Semiconductor packages with chips partially embedded in adhesive
SAMSUNG ELECTRONICS CO LTD4 citations71
US7479455B2Jan 20, 2009
Method for manufacturing semiconductor wafer
SAMSUNG ELECTRONICS CO LTD3 citations61
US12495504B2Dec 9, 2025
Ball attach tool
SAMSUNG ELECTRONICS CO LTD0 citations51
US7262114B2Aug 28, 2007
Die attaching method of semiconductor chip using warpage prevention material
SAMSUNG ELECTRONICS CO LTD1 citations50