Inventor
DRYER PAUL WILLIAM
US17 patents
⚠️ This page may combine multiple inventors who share the name “DRYER PAUL WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BERNARD DAVID LAURIER
4 patentsUS8324076B2Dec 4, 2012
Micro-fluid ejection heads and methods for bonding substrates to supports
BERNARD DAVID LAURIER2 citations58
US8882221B2Nov 11, 2014
Modular micro-fluid ejection head assembly
BERNARD DAVID LAURIER0 citations48
US8826502B2Sep 9, 2014
Method for making a substantially planar micro-fluid ejection head
BERNARD DAVID LAURIER0 citations48
US8071275B2Dec 6, 2011
Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods
BERNARD DAVID LAURIER1 citations48
SPEEDFAM IPEC CORP
3 patentsUS6021791AFeb 8, 2000
Method and apparatus for immersion cleaning of semiconductor devices
SPEEDFAM IPEC CORP115 citations96
US6146468ANov 14, 2000
Semiconductor wafer treatment
SPEEDFAM IPEC CORP27 citations90
US6244280B1Jun 12, 2001
Method and apparatus for immersion treatment of semiconductor and other devices
SPEEDFAM IPEC CORP8 citations71
LEXMARK INT INC
3 patentsUS7938513B2May 10, 2011
Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips
LEXMARK INT INC7 citations82
US7531047B1May 12, 2009
Method of removing residue from a substrate after a DRIE process
LEXMARK INT INC10 citations78
US7815289B2Oct 19, 2010
Micro-fluid ejection heads and methods for bonding substrates to supports
LEXMARK INT INC0 citations50