Inventor

HSIA DER-LING

TW4 patents

⚠️ This page may combine multiple inventors who share the name “HSIA DER-LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHIA-EN

3 patents

US8278681B2Oct 2, 2012

Light-emitting diode package and wafer-level packaging process of light-emitting diode

LEE CHIA-EN7 citations81

US8445327B2May 21, 2013

Light-emitting diode package and wafer-level packaging process of light-emitting diode

LEE CHIA-EN0 citations49

US8415683B2Apr 9, 2013

Light emitting diode chip

LEE CHIA-EN0 citations38

LEXTAR ELECTRONICS CORP

1 patent

US9461213B2Oct 4, 2016

LED sub-mount and method for manufacturing light emitting device using the sub-mount

LEXTAR ELECTRONICS CORP1 citations49