Inventor

YANG SONG-FU

TW3 patents

⚠️ This page may combine multiple inventors who share the name “YANG SONG-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

2 patents

US7547575B2Jun 16, 2009

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

ADVANCED SEMICONDUCTOR ENG7 citations71

US7581666B2Sep 1, 2009

Wire-bonding method for wire-bonding apparatus

ADVANCED SEMICONDUCTOR ENG1 citations49

ASE SHANGHAI INC

1 patent

US7445944B2Nov 4, 2008

Packaging substrate and manufacturing method thereof

ASE SHANGHAI INC5 citations59