Inventor

CHEAH CHUAN

US60 patents

⚠️ This page may combine multiple inventors who share the name “CHEAH CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEAH CHUAN

INT RECTIFIER CORP

Commonly housed diverse semiconductor die

Co-packaged MOS-gated device and control integrated circuit

Semiconductor package

Commonly housed diverse semiconductor

Multi-chip module

Method of manufacturing a semiconductor chip array with two-sided cooling

Chip array with two-sided cooling

Commonly housed diverse semiconductor die

Commonly housed diverse semiconductor die

Solder-on back metal for semiconductor die

Heat dissipating device package

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor device module with flip chip devices on a common lead frame

Three commonly housed diverse semiconductor dice

Stacked half-bridge package with a common leadframe

Semiconductor package with multiple conductive clips

High current lead electrode for semiconductor device

Semiconductor package

Three commonly housed diverse semiconductor dice

Contact structure for semiconductor device

Semiconductor package with conductive heat spreader

Power device with solderable front metal

High voltage cascoded III-nitride rectifier package

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Interdigitated conductive lead frame or laminate lead frame for GaN die

Copper straps

Cascoded rectifier package

Tin antimony solder for MOSFET with TiNiAg back metal

CHO EUNG SAN

High power semiconductor package with multiple conductive clips

High power semiconductor package with conductive clip on multiple transistors

High power semiconductor package with conductive clips and flip chip driver IC

Stacked half-bridge package with a common conductive leadframe

High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor

Stacked half-bridge package with a current carrying layer

Stacked half-bridge package with a common conductive clip

INFINEON TECHNOLOGIES AMERICAS CORP

Stacked half-bridge package

Semiconductor package with heat spreader

Breakable substrate for semiconductor die

Compact high-voltage semiconductor package

Compact high-voltage semiconductor package

Stacked half-bridge package

CHEAH CHUAN

III-nitride power device with solderable front metal

High voltage cascoded III-nitride rectifier package with stamped leadframe

High voltage cascoded III-nitride rectifier package utilizing clips on package surface

HU KUNZHONG

Semiconductor package with metal straps

Interdigitated conductive support for GaN semiconductor die

PHILLIPS TIMOTHY A

Packaging of electronic circuitry

BRIERE MICHAEL A

Semiconductor package

INFINEON TECHNOLOGIES AG

Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module

SHIVKUMAR BHARAT

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance