Inventor
THIMMEGOWDA DEEPAK
US31 patents
⚠️ This page may combine multiple inventors who share the name “THIMMEGOWDA DEEPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
16 patentsUS10269626B2Apr 23, 2019
Stair step formation using at least two masks
MICRON TECHNOLOGY INC12 citations92
US9219070B2Dec 22, 2015
3-D memory arrays
MICRON TECHNOLOGY INC21 citations92
US9870941B2Jan 16, 2018
Stair step formation using at least two masks
MICRON TECHNOLOGY INC7 citations84
US9557376B2Jan 31, 2017
Apparatuses and methods for die seal crack detection
MICRON TECHNOLOGY INC10 citations84
US9287184B2Mar 15, 2016
Apparatuses and methods for die seal crack detection
MICRON TECHNOLOGY INC14 citations84
US9082772B2Jul 14, 2015
Stair step formation using at least two masks
MICRON TECHNOLOGY INC8 citations84
US10770470B2Sep 8, 2020
Memory array having connections going through control gates
MICRON TECHNOLOGY INC10 citations83
US8853769B2Oct 7, 2014
Transistors and semiconductor constructions
MICRON TECHNOLOGY INC5 citations81
US11393716B2Jul 19, 2022
Devices including stair step structures, and related apparatuses and memory devices
MICRON TECHNOLOGY INC1 citations73
US11398489B2Jul 26, 2022
Memory array having connections going through control gates
MICRON TECHNOLOGY INC1 citations72
US11424256B2Aug 23, 2022
Transistors, semiconductor constructions, and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations60
US10748811B2Aug 18, 2020
Memory devices and related methods
MICRON TECHNOLOGY INC0 citations52
US9508591B2Nov 29, 2016
Stair step formation using at least two masks
MICRON TECHNOLOGY INC0 citations52
US10497707B2Dec 3, 2019
Semiconductor constructions which include metal-containing gate portions and semiconductor-containing gate portions
MICRON TECHNOLOGY INC0 citations49
US9613978B2Apr 4, 2017
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations49
US9219132B2Dec 22, 2015
Transistors, semiconductor constructions, and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations49
INTEL CORP
6 patentsUS10043751B2Aug 7, 2018
Three dimensional storage cell array with highly dense and scalable word line design approach
INTEL CORP5 citations83
US9865357B1Jan 9, 2018
Performing read operations on a memory device
INTEL CORP4 citations73
US10593624B2Mar 17, 2020
Three dimensional storage cell array with highly dense and scalable word line design approach
INTEL CORP3 citations72
US10804280B2Oct 13, 2020
Memory device with vertical string drivers
INTEL CORP0 citations52
US11653496B2May 16, 2023
Asymmetric junctions of high voltage transistor in NAND flash memory
INTEL CORP0 citations51
US10515973B2Dec 24, 2019
Wordline bridge in a 3D memory array
INTEL CORP0 citations40
Intel NDTM US LLC
6 patentsUS12089412B2Sep 10, 2024
Vertical string driver with extended gate junction structure
Intel NDTM US LLC0 citations62
US12563725B2Feb 24, 2026
Parallel staircase 3D NAND
Intel NDTM US LLC0 citations53
US12148802B2Nov 19, 2024
Vertical string driver with channel field management structure
Intel NDTM US LLC0 citations51
US12120878B2Oct 15, 2024
Block-to-block isolation and deep contact using pillars in a memory array
Intel NDTM US LLC0 citations50
US12520495B2Jan 6, 2026
3D NAND with IO contacts in isolation trench
Intel NDTM US LLC0 citations45
US12340845B2Jun 24, 2025
Split block array for 3D NAND memory
Intel NDTM US LLC0 citations44