Inventor
HALLIYAL ARVIND
US82 patents
⚠️ This page may combine multiple inventors who share the name “HALLIYAL ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
39 patentsUS6803272B1Oct 12, 2004
Use of high-K dielectric material in modified ONO structure for semiconductor devices
ADVANCED MICRO DEVICES INC149 citations99
US6674138B1Jan 6, 2004
Use of high-k dielectric materials in modified ONO structure for semiconductor devices
ADVANCED MICRO DEVICES INC490 citations99
US6645882B1Nov 11, 2003
Preparation of composite high-K/standard-K dielectrics for semiconductor devices
ADVANCED MICRO DEVICES INC122 citations99
US6642573B1Nov 4, 2003
Use of high-K dielectric material in modified ONO structure for semiconductor devices
ADVANCED MICRO DEVICES INC253 citations99
US6586349B1Jul 1, 2003
Integrated process for fabrication of graded composite dielectric material layers for semiconductor devices
ADVANCED MICRO DEVICES INC220 citations99
US6740605B1May 25, 2004
Process for reducing hydrogen contamination in dielectric materials in memory devices
ADVANCED MICRO DEVICES INC140 citations98
US6670241B1Dec 30, 2003
Semiconductor memory with deuterated materials
ADVANCED MICRO DEVICES INC79 citations98
US6451641B1Sep 17, 2002
Non-reducing process for deposition of polysilicon gate electrode over high-K gate dielectric material
ADVANCED MICRO DEVICES INC148 citations98
US6406960B1Jun 18, 2002
Process for fabricating an ONO structure having a silicon-rich silicon nitride layer
ADVANCED MICRO DEVICES INC83 citations98
US6265268B1Jul 24, 2001
High temperature oxide deposition process for fabricating an ONO floating-gate electrode in a two bit EEPROM device
ADVANCED MICRO DEVICES INC94 citations97
US6563183B1May 13, 2003
Gate array with multiple dielectric properties and method for forming same
ADVANCED MICRO DEVICES INC113 citations96
US6248628B1Jun 19, 2001
Method of fabricating an ONO dielectric by nitridation for MNOS memory cells
ADVANCED MICRO DEVICES INC68 citations94
US7079975B1Jul 18, 2006
Scatterometry and acoustic based active control of thin film deposition process
ADVANCED MICRO DEVICES INC20 citations93
US7001814B1Feb 21, 2006
Laser thermal annealing methods for flash memory devices
ADVANCED MICRO DEVICES INC31 citations93
US6872643B1Mar 29, 2005
Implant damage removal by laser thermal annealing
ADVANCED MICRO DEVICES INC18 citations93
US6828162B1Dec 7, 2004
System and method for active control of BPSG deposition
ADVANCED MICRO DEVICES INC32 citations93
US6783591B1Aug 31, 2004
Laser thermal annealing method for high dielectric constant gate oxide films
ADVANCED MICRO DEVICES INC20 citations93
US6774989B1Aug 10, 2004
Interlayer dielectric void detection
ADVANCED MICRO DEVICES INC21 citations93
US6752899B1Jun 22, 2004
Acoustic microbalance for in-situ deposition process monitoring and control
ADVANCED MICRO DEVICES INC43 citations93
US6750066B1Jun 15, 2004
Precision high-K intergate dielectric layer
ADVANCED MICRO DEVICES INC125 citations93
US6731006B1May 4, 2004
Doped copper interconnects using laser thermal annealing
ADVANCED MICRO DEVICES INC33 citations93
US6693004B1Feb 17, 2004
Interfacial barrier layer in semiconductor devices with high-K gate dielectric material
ADVANCED MICRO DEVICES INC33 citations93
US6693321B1Feb 17, 2004
Replacing layers of an intergate dielectric layer with high-K material for improved scalability
ADVANCED MICRO DEVICES INC50 citations93
US6642066B1Nov 4, 2003
Integrated process for depositing layer of high-K dielectric with in-situ control of K value and thickness of high-K dielectric layer
ADVANCED MICRO DEVICES INC98 citations93
US6633392B1Oct 14, 2003
X-ray reflectance system to determine suitability of SiON ARC layer
ADVANCED MICRO DEVICES INC21 citations93
US6593748B1Jul 15, 2003
Process integration of electrical thickness measurement of gate oxide and tunnel oxides by corona discharge technique
ADVANCED MICRO DEVICES INC44 citations93
US6563578B2May 13, 2003
In-situ thickness measurement for use in semiconductor processing
ADVANCED MICRO DEVICES INC30 citations93
US6509282B1Jan 21, 2003
Silicon-starved PECVD method for metal gate electrode dielectric spacer
ADVANCED MICRO DEVICES INC19 citations93
US6319775B1Nov 20, 2001
Nitridation process for fabricating an ONO floating-gate electrode in a two-bit EEPROM device
ADVANCED MICRO DEVICES INC65 citations93
US6849925B1Feb 1, 2005
Preparation of composite high-K/standard-K dielectrics for semiconductor devices
ADVANCED MICRO DEVICES INC22 citations92
US6774432B1Aug 10, 2004
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL
ADVANCED MICRO DEVICES INC31 citations92
US6764966B1Jul 20, 2004
Spacers with a graded dielectric constant for semiconductor devices having a high-K dielectric
ADVANCED MICRO DEVICES INC28 citations92
US6727176B2Apr 27, 2004
Method of forming reliable Cu interconnects
ADVANCED MICRO DEVICES INC22 citations92
US6653191B1Nov 25, 2003
Memory manufacturing process using bitline rapid thermal anneal
ADVANCED MICRO DEVICES INC40 citations92
US6617215B1Sep 9, 2003
Memory wordline hard mask
ADVANCED MICRO DEVICES INC47 citations92
US6512264B1Jan 28, 2003
Flash memory having pre-interpoly dielectric treatment layer and method of forming
ADVANCED MICRO DEVICES INC37 citations92
US6410388B1Jun 25, 2002
Process for optimizing pocket implant profile by RTA implant annealing for a non-volatile semiconductor device
ADVANCED MICRO DEVICES INC39 citations92
US6218227B1Apr 17, 2001
Method to generate a MONOS type flash cell using polycrystalline silicon as an ONO top layer
ADVANCED MICRO DEVICES INC19 citations92
US6180538B1Jan 30, 2001
Process for fabricating an ONO floating-gate electrode in a two-bit EEPROM device using rapid-thermal-chemical-vapor-deposition
ADVANCED MICRO DEVICES INC50 citations92
FASL LLC
8 patentsUS7033957B1Apr 25, 2006
ONO fabrication process for increasing oxygen content at bottom oxide-substrate interface in flash memory devices
FASL LLC62 citations96
US6803275B1Oct 12, 2004
ONO fabrication process for reducing oxygen vacancy content in bottom oxide layer in flash memory devices
FASL LLC46 citations96
US6949433B1Sep 27, 2005
Method of formation of semiconductor resistant to hot carrier injection stress
FASL LLC103 citations95
US6955965B1Oct 18, 2005
Process for fabrication of nitride layer with reduced hydrogen content in ONO structure in semiconductor device
FASL LLC26 citations93
US6969886B1Nov 29, 2005
ONO fabrication process for reducing oxygen vacancy content in bottom oxide layer in flash memory devices
FASL LLC28 citations92
US6958511B1Oct 25, 2005
Flash memory device and method of fabrication thereof including a bottom oxide layer with two regions with different concentrations of nitrogen
FASL LLC52 citations92
US6949481B1Sep 27, 2005
Process for fabrication of spacer layer with reduced hydrogen content in semiconductor device
FASL LLC50 citations92
US6884681B1Apr 26, 2005
Method of manufacturing a semiconductor memory with deuterated materials
FASL LLC31 citations92
SPANSION LLC
2 patentsUS7115469B1Oct 3, 2006
Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process
SPANSION LLC135 citations98
US7163860B1Jan 16, 2007
Method of formation of gate stack spacer and charge storage materials having reduced hydrogen content in charge trapping dielectric flash memory device
SPANSION LLC25 citations92
HAUN MICHAEL J
1 patentShowing the top 50 of 82 patents by PatentIndex Score.