Inventor
JEON JOONG S
US26 patents
⚠️ This page may combine multiple inventors who share the name “JEON JOONG S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
16 patentsUS6645882B1Nov 11, 2003
Preparation of composite high-K/standard-K dielectrics for semiconductor devices
ADVANCED MICRO DEVICES INC122 citations99
US6586349B1Jul 1, 2003
Integrated process for fabrication of graded composite dielectric material layers for semiconductor devices
ADVANCED MICRO DEVICES INC220 citations99
US7071051B1Jul 4, 2006
Method for forming a thin, high quality buffer layer in a field effect transistor and related structure
ADVANCED MICRO DEVICES INC550 citations98
US6764898B1Jul 20, 2004
Implantation into high-K dielectric material after gate etch to facilitate removal
ADVANCED MICRO DEVICES INC76 citations98
US6451641B1Sep 17, 2002
Non-reducing process for deposition of polysilicon gate electrode over high-K gate dielectric material
ADVANCED MICRO DEVICES INC148 citations98
US6693004B1Feb 17, 2004
Interfacial barrier layer in semiconductor devices with high-K gate dielectric material
ADVANCED MICRO DEVICES INC33 citations93
US6849925B1Feb 1, 2005
Preparation of composite high-K/standard-K dielectrics for semiconductor devices
ADVANCED MICRO DEVICES INC22 citations92
US6797572B1Sep 28, 2004
Method for forming a field effect transistor having a high-k gate dielectric and related structure
ADVANCED MICRO DEVICES INC36 citations92
US7176531B1Feb 13, 2007
CMOS gates formed by integrating metals having different work functions and having a high-k gate dielectric
ADVANCED MICRO DEVICES INC22 citations91
US6872613B1Mar 29, 2005
Method for integrating metals having different work functions to form CMOS gates having a high-k gate dielectric and related structure
ADVANCED MICRO DEVICES INC28 citations91
US6905971B1Jun 14, 2005
Treatment of dielectric material to enhance etch rate
ADVANCED MICRO DEVICES INC9 citations74
US6902977B1Jun 7, 2005
Method for forming polysilicon gate on high-k dielectric and related structure
ADVANCED MICRO DEVICES INC10 citations74
US6991990B1Jan 31, 2006
Method for forming a field effect transistor having a high-k gate dielectric
ADVANCED MICRO DEVICES INC3 citations63
US6762454B1Jul 13, 2004
Stacked polysilicon layer for boron penetration inhibition
ADVANCED MICRO DEVICES INC4 citations63
US7026211B1Apr 11, 2006
Semiconductor component and method of manufacture
ADVANCED MICRO DEVICES INC4 citations62
US6992370B1Jan 31, 2006
Memory cell structure having nitride layer with reduced charge loss and method for fabricating same
ADVANCED MICRO DEVICES INC2 citations60
SAMSUNG ELECTRONICS CO LTD
6 patentsUS9318573B2Apr 19, 2016
Field effect transistor having germanium nanorod and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD15 citations82
US7674665B2Mar 9, 2010
Method of fabricating Schottky barrier transistor
SAMSUNG ELECTRONICS CO LTD5 citations62
US7902011B2Mar 8, 2011
Method of fabricating Schottky barrier transistor
SAMSUNG ELECTRONICS CO LTD1 citations52
US7800186B2Sep 21, 2010
Semiconductor device and method of fabricating metal gate of the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US7863142B2Jan 4, 2011
Method of forming a germanium silicide layer, semiconductor device including the germanium silicide layer, and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US7884410B2Feb 8, 2011
Nonvolatile memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations49