Inventor
HASHIMOTO MUNENORI
JP2 patents
Patents
2 patentsUS8516692B2Aug 27, 2013
Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate
OSHIKA YOSHIKAZU2 citations56
US8747579B2Jun 10, 2014
Solder layer and device bonding substrate using the same and method for manufacturing such a substrate
OSHIKA YOSHIKAZU1 citations46