Inventor
OHSAWA KENJI
JP43 patents
⚠️ This page may combine multiple inventors who share the name “OHSAWA KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
38 patentsUS6514847B1Feb 4, 2003
Method for making a semiconductor device
SONY CORP180 citations98
US6093970AJul 25, 2000
Semiconductor device and method for manufacturing the same
SONY CORP56 citations96
US6051450AApr 18, 2000
Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
SONY CORP72 citations96
US5945741AAug 31, 1999
Semiconductor chip housing having a reinforcing plate
SONY CORP74 citations96
US5886399AMar 23, 1999
Lead frame and integrated circuit package
SONY CORP53 citations96
US5786239AJul 28, 1998
Method of manufacturing a semiconductor package
SONY CORP51 citations96
US5756377AMay 26, 1998
Lead frame and manufacturing method thereof
SONY CORP38 citations96
US5723900AMar 3, 1998
Resin mold type semiconductor device
SONY CORP62 citations96
US6258631B1Jul 10, 2001
Semiconductor package and the manufacturing method
SONY CORP21 citations93
US6240632B1Jun 5, 2001
Method of manufacturing lead frame and integrated circuit package
SONY CORP21 citations93
US6194778B1Feb 27, 2001
Semiconductor package with improved cross talk and grounding, and method of manufacturing same
SONY CORP28 citations93
US6114755ASep 5, 2000
Semiconductor package including chip housing, encapsulation and the manufacturing method
SONY CORP28 citations93
US6104091AAug 15, 2000
Semiconductor package and the manufacturing method
SONY CORP36 citations93
US6078097AJun 20, 2000
Lead frame
SONY CORP30 citations93
US6074898AJun 13, 2000
Lead frame and integrated circuit package
SONY CORP21 citations93
US5982033ANov 9, 1999
Semiconductor chip package
SONY CORP26 citations93
US5221428AJun 22, 1993
Production of lead frame
SONY CORP49 citations93
US4398975AAug 16, 1983
Conductive paste
SONY CORP56 citations93
US7374104B2May 20, 2008
Memory card
SONY CORP21 citations92
US6563202B1May 13, 2003
Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
SONY CORP24 citations92
US6351025B1Feb 26, 2002
Semiconductor chip having an underplate metal layer
SONY CORP22 citations92
US6020626AFeb 1, 2000
Semiconductor device
SONY CORP25 citations92
US5481798AJan 9, 1996
Etching method for forming a lead frame
SONY CORP26 citations92
US5349238ASep 20, 1994
Semiconductor device
SONY CORP41 citations92
US4528064AJul 9, 1985
Method of making multilayer circuit board
SONY CORP53 citations92
US4677252AJun 30, 1987
Circuit board
SONY CORP41 citations91
US4435611AMar 6, 1984
Conductive paste
SONY CORP33 citations90
US6054773AApr 25, 2000
Semiconductor device and method of manufacturing the same
SONY CORP17 citations84
US6403402B1Jun 11, 2002
Semiconductor chip having an underplate metal layer
SONY CORP5 citations74
US6391684B2May 21, 2002
Lead frame and manufacturing method thereof
SONY CORP9 citations74
US6340840B1Jan 22, 2002
Lead frame and production method thereof, and semiconductor device and fabrication method thereof
SONY CORP10 citations74
US6140153AOct 31, 2000
Lead frame, the manufacturing method, semiconductor device and the manufacturing method
SONY CORP7 citations74
US5901436AMay 11, 1999
Method of manufacturing lead frame
SONY CORP13 citations74
US6838368B1Jan 4, 2005
Method for making semiconductor device using a nickel film for stopping etching
SONY CORP11 citations73
US5437764AAug 1, 1995
Lead frame and manufacturing method therefor
SONY CORP6 citations73
US6465279B2Oct 15, 2002
Lead frame and production method thereof, and semiconductor device and fabrication method thereof
SONY CORP4 citations63
US6369441B1Apr 9, 2002
Method of producing a semiconductor chip having an underplate metal layer
SONY CORP2 citations63
US5937278AAug 10, 1999
Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer
SONY CORP3 citations62
OHSAWA KENJI
4 patentsUS8534348B2Sep 17, 2013
Heat pipe and method for manufacturing same
OHSAWA KENJI12 citations81
US8982559B2Mar 17, 2015
Heat sink, cooling module and coolable electronic board
OHSAWA KENJI8 citations78
US8988882B2Mar 24, 2015
Heat sink package and method of manufacturing
OHSAWA KENJI1 citations45
US9240365B2Jan 19, 2016
Cooling device and electronic device
OHSAWA KENJI0 citations38